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Spliced screen and preparation method thereof

A technology of splicing screen and encapsulation layer, applied in the field of splicing screen and splicing screen preparation, can solve the problems of flexible screen splicing difficulty, affecting product life, easy to deform, etc.

Pending Publication Date: 2022-07-15
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, to make a large-size screen, flexible mini-LED screens need to be spliced ​​together. The splicing of flexible screens is difficult, and the joints are subject to stress factors during bending, and are easily deformed, resulting in separation from the upper and lower protective films. , affecting product life

Method used

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  • Spliced screen and preparation method thereof
  • Spliced screen and preparation method thereof
  • Spliced screen and preparation method thereof

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present application, but not to limit the present application. In this application, unless otherwise stated, the directional words used such as "upper" and "lower" generally refer to the upper and lower sides of the device in actual use or working state, specifically the drawing direction in the accompanying drawings ; while "inside...

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Abstract

The embodiment of the invention discloses a spliced screen and a preparation method of the spliced screen. The spliced screen comprises at least two panels, a filling layer and a first protective film layer, each panel comprises a light-emitting substrate and a packaging layer, the packaging layers package and cover the light-emitting substrates, the adjacent panels are arranged in a spliced mode, the side wall faces of the two adjacent packaging layers define a containing space with an opening in an enclosed mode, and the opening is located in the sides, away from the light-emitting substrates, of the packaging layers; the filling layer penetrates through the opening and is arranged in the accommodating space, and the elastic modulus of the filling layer is lower than or equal to that of the packaging layer; the first protective film layer is arranged on the surfaces, away from the light-emitting substrate, of the packaging layers of the at least two panels and connected with the filling layer located in the containing space. The risk that the first protective film layer is separated from the panel after bending is reduced, so that the stability of the first protective film layer after setting is guaranteed, and then the service life of the spliced screen is prolonged.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a splicing screen and a method for preparing a splicing screen. Background technique [0002] Light Emitting Diodes (LED) is a semiconductor electronic component that can convert electrical energy into light energy. Because of its small size, long service life, colorful colors, and low energy consumption, it is widely used in lighting, Displays, signal lights, backlights, toys and other fields. Flexible electronic products have attracted worldwide attention and developed rapidly. [0003] During the research and practice of the prior art, the inventors of the present application found that, during the manufacturing process of at least some flexible devices in flexible electronic products, PI films (polyimide Thin film), make related electronic devices on the PI film, and separate the glass substrate from the PI film after the related electronic devices are made to fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54G09F9/33
CPCH01L25/0753H01L33/54G09F9/33H01L2933/005
Inventor 胡小波
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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