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Chip unpacking scribing device and adjusting method thereof

A dicing and chip technology, which is applied in the field of dicing devices for chip unpacking machines, can solve the problems of thin thickness, small bar volume, poor scribing consistency, etc., and achieve the effects of high control precision, convenient use and strong practicability

Pending Publication Date: 2022-07-22
泉州兰姆达仪器设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The laser chip is separated from the bar, and it is necessary to use a scribe to scribe during the separation process; due to the small size and thin thickness of the bar, the existing scribing force is not easy to control, and it is easy to scratch the bar or chip, and Poor dicing consistency

Method used

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  • Chip unpacking scribing device and adjusting method thereof
  • Chip unpacking scribing device and adjusting method thereof
  • Chip unpacking scribing device and adjusting method thereof

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Embodiment Construction

[0017] It should be noted that the following detailed description is exemplary and intended to provide further explanation of the application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

[0018] It should be noted that the terminology used herein is for the purpose of describing specific embodiments only, and is not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include the plural as well, furthermore, it is to be understood that when the terms "comprising" and / or "including" are used in this specification, it indicates that There are features, steps, operations, devices, components and / or combinations thereof.

[0019] like Figures 1~5 As shown in the figure, a dicing device for chip dismantling machine in...

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Abstract

The invention relates to a scribing device of a chip dividing machine and an adjusting method thereof, the scribing device comprises a machine table, a stand column is arranged on the table top of the machine table, a scribing knife mechanism for scribing a bar is arranged in front of the stand column, and the scribing knife mechanism is controlled by a lifting driving mechanism on the front side of the stand column to ascend and descend; the cutter mechanism comprises a cutter holder and a swing arm on the lower side of the cutter holder, the rear portion of the swing arm is rotatably connected to the cutter holder, the front end of the swing arm extends out of the front side of the cutter holder and is connected with a shaft, and a cutter head penetrates through the middle of the shaft in the radial direction. A balancing weight is connected to the rear end of the swing arm, an elastic piece is arranged in the middle of the swing arm, the rear end of the elastic piece is connected to the swing arm, the front end of the elastic piece is suspended, and an adjusting bolt with the lower end abutting against the front end of the elastic piece is connected to the upper side of the tool apron. The scribing device of the chip splitting machine is reasonable in design, convenient to use and high in practicability, the pressure of the tool bit on the bar is controlled through the elastic piece, the scribing strength is convenient to control, the scribing strength can be controlled within 1 g, the control precision is high, meanwhile, the elastic force can be adjusted by rotating the adjusting bolt, and the force control function of the tool bit is achieved.

Description

technical field [0001] The invention relates to the technical field of laser chip processing, in particular to a chip slicing machine dicing device and an adjustment method thereof. Background technique [0002] The laser chip is separated from the bar, and a scribing knife needs to be used for scribing during the separation process; due to the small size and thin thickness of the bar, the existing scribing force is not easy to control, and it is easy to scratch the bar or chip, and The dicing consistency is poor. SUMMARY OF THE INVENTION [0003] In view of this, the purpose of the present invention is to provide a dicing device and an adjusting method for a chip disassembler which is convenient to control the dicing force and has high control precision. [0004] The present invention adopts the following scheme to realize: a chip dismantling machine scribing device, including a machine table, a column is arranged on the table surface of the machine table, and a scribing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D5/04H01S5/02
CPCB28D5/04B28D5/0058H01S5/0201Y02P70/50
Inventor 邓艳汉苏婷
Owner 泉州兰姆达仪器设备有限公司
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