Material taking and placing device, material taking and placing method and chip production equipment

Abstract

The embodiment of the invention discloses a material taking and placing device, a material taking and placing method and chip production equipment, which are used for executing the transfer taking and placing operation of a whole disc of chips between a tray and a transfer disc, and the method comprises the following steps: a transverse movement module drives a material taking and placing execution terminal to move to the upper part of the tray; the longitudinal movement module drives the material taking and placing execution terminal to descend and get close to the surface of the tray, and the material taking and placing execution terminal sucks the whole disc of chips; the transverse movement module and the longitudinal movement module are linked to drive the material taking and placing execution terminal to move to a specified height position above the middle rotating disc; and the material taking and placing execution terminal releases the whole disc of chips to the transfer disc, and the transfer disc enters a subsequent detection process. According to the material taking and placing method and the material taking and placing device, one-time taking and placing and transferring of the whole disc of chips can be achieved, limitation of structural arrangement and size is avoided, it is guaranteed that the whole disc of chips are reliably taken and placed, and the production takt and the production efficiency are guaranteed.

Description

technical field [0001] The invention relates to the technical field of chip production and processing, in particular to a pick-and-place device, a pick-and-unload method, and chip production equipment. Background technique [0002] In recent years, with the continuous improvement of people's consumption level and quality of life, the demand for consumer electronic products, intelligent interactive devices and other products has exploded, and chips play a role in controlling the brain, playing a role in such products. At the same time, the demand for chips is also increasing. [0003] At present, chips are prepared using chip production equipment. In the material preparation stage, the chips are placed in a special tray and enter the processing process. During production, the single suction cup transfer robot picks up the chips from the tray and transfers them to the subsequent processing station. In order to improve the chip pick-and-place and transfer efficiency, multipl...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a pick-and-place device, a pick-and-place method, and chip production equipment, which are used to solve the problem of pick-and-place chips in the prior art. There is a big limitation in the quantity, and the failure of picking and placing the chip affects the production efficiency and the beat

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