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Cutting device

A cutting device and cutting tool technology, applied in positioning devices, devices for fixing grinding wheels, fine work devices, etc., can solve problems such as cutting tools or nuts falling off, cutting device collisions, etc.

Pending Publication Date: 2022-07-29
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, when removing the cutting tool from the tool box or storing the cutting tool in the tool holder by manual work, there is concern that the cutting tool or the nut may be accidentally dropped or collided with the cutting device.

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0043] Hereinafter, an embodiment of one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view which shows the cutting apparatus 2 of this embodiment. In addition, in figure 1 Among them, the X-axis direction (machining feed direction, the first horizontal direction, the front-rear direction) and the Y-axis direction (the indexing feed direction, the second horizontal direction, the left-right direction) are mutually perpendicular directions. In addition, the Z-axis direction (vertical direction, vertical direction, height direction) is a direction perpendicular to the X-axis direction and the Y-axis direction.

[0044] The cutting device 2 has a base 4 that supports or accommodates the respective components constituting the cutting device 2 . A lifter 6 having a lifter 6 a is provided at a corner portion on the front side of the base 4 . The lifter 6 has a lift mechanism (not shown), and lifts and lowers the...

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PUM

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Abstract

The invention provides a cutting device which does not need to take out a cutting tool from a tool box through manual operation. The cutting device includes: a cutting unit including a main shaft serving as a rotating shaft, and an attachment flange fixed to a tip of the main shaft and to which a cutting tool is attached; a support unit that includes a tool box support part that supports a tool box in which the cutting tool is housed, and that supports the cutting tool in a state of being housed in the tool box; a replacement mechanism that removes the cutting tool from the mounting flange in a state in which the cutting tool is mounted, and mounts the cutting tool supported by the support unit to the mounting flange; and a movement mechanism that moves the replacement mechanism between a replacement position at which the cutting tool can be attached to and detached from the attachment flange, a tool transfer position at which the cutting tool can be transferred to and from the support unit, and a retracted position away from the replacement position and the tool transfer position.

Description

technical field [0001] The present invention relates to a cutting device for cutting a workpiece with a cutting tool. Background technique [0002] A plurality of device chips each having a device is manufactured by dividing a wafer on which a plurality of devices including semiconductor integrated circuits are formed. In addition, when a plurality of device chips are mounted on a predetermined substrate and then the mounted device chips are covered with a sealing material (molding resin), a package substrate is obtained. This package substrate is divided, thereby manufacturing a packaged device having one or more packaged device chips. Packaged devices are mounted on various electronic devices such as mobile phones and personal computers. [0003] A cutting device is used to divide a workpiece such as a wafer or a package substrate. The cutting device includes a chuck table that holds a workpiece and a cutting unit that performs cutting processing on the workpiece. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/06B24B41/04B24B45/00B24B41/02B24B49/12B24B41/00
CPCB24B27/0683B24B41/04B24B45/003B24B41/02B24B49/12B24B41/00B28D5/022B24B45/006B24B27/06B24B53/12H01L21/67092B23Q3/15546B23Q3/15713Y10T483/174
Inventor 苏志博寺田一贵
Owner DISCO CORP
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