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High-power module heat dissipation structure

A heat dissipation structure and high-power technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of harsh environment, difficult module heat dissipation, high density, etc., and achieve effective heat dissipation

Pending Publication Date: 2022-07-29
惠州市硕众导热科技有限公司
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  • Summary
  • Abstract
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  • Claims
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Problems solved by technology

[0002] Existing power control modules for underground mining areas have a concentrated number of power modules, high density, and harsh environments, limited equipment space, high temperature environments above 40 degrees, difficult heat dissipation of the modules, and total power consumption of the modules is about 800W. It is necessary to control the overall The temperature is below 75 degrees, so it is necessary to design a corresponding heat dissipation structure for heat dissipation and temperature control

Method used

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specific Embodiment 1

[0018] Specific Example 1: Please refer to Figure 1 to Figure 4 In the embodiment of the present invention, a high-power module heat dissipation structure, a high-power module heat dissipation structure, includes an aluminum substrate 6, the upper layer of the aluminum substrate 6 is placed with a first high-power module group 2, and the lower layer of the aluminum substrate 6 is placed with a first high-power module group 2. Two high-power module groups 8, a first heat-conducting patch group 3 is arranged between the first high-power module group 2 and the aluminum substrate 6 for transferring heat from the first high-power module group 2 to the aluminum substrate 6, and the second large-power module group 2 A second heat-conducting patch group 7 is arranged between the power module group 8 and the aluminum substrate 6 for transferring the heat of the second high-power module group 8 to the aluminum substrate 6, and a high-density heat sink 10 and a The aluminum substrate 6 ...

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Abstract

The invention provides a high-power module heat dissipation structure which comprises an aluminum substrate, a first high-power module set is placed on the upper layer of the aluminum substrate, a second high-power module set is placed on the lower layer of the aluminum substrate, and a first heat conduction patch set is arranged between the first high-power module set and the aluminum substrate and used for transferring heat of the first high-power module set to the aluminum substrate. A second heat conduction patch set is arranged between the second high-power module set and the aluminum substrate and used for transmitting heat of the second high-power module set to the aluminum substrate, a high-density radiator is installed below the aluminum substrate and makes contact with the aluminum substrate, and a center substrate is installed in the aluminum substrate. According to the high-power module heat dissipation structure provided by the invention, heat is concentrated and dispersed by utilizing spatial layout, the heat of each module on the aluminum plate is transferred to the high-density radiator by matching with the high-density radiator and utilizing the high heat conduction performance of the heat pipe, and meanwhile, the centrifugal fan is additionally arranged in the middle of the high-density radiator; heat of the radiator can be effectively brought out by the centrifugal fan in the center for effective heat dissipation.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation structure of a high-power module. Background technique [0002] The existing power control modules for underground mining areas have a concentrated number of power modules, high density, and harsh environment, limited equipment space, high temperature environment above 40 degrees, and difficulty in module heat dissipation. The total power consumption of the module is about 800W, and it is necessary to control the overall The temperature is below 75 degrees, so it is necessary to design a corresponding heat dissipation structure for heat dissipation and temperature control. SUMMARY OF THE INVENTION [0003] The purpose of the present invention is to provide a heat dissipation structure for a high-power module to solve the technical problems in the background art. [0004] To achieve the foregoing purpose, the present invention provides the fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20145H05K7/2039
Inventor 韩飞王映珺
Owner 惠州市硕众导热科技有限公司
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