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Encapsulated radio frequency identification in consumable chamber components

A consumable, component technology used in electrical components, conveyor items, transportation and packaging to solve problems such as large downtimes

Pending Publication Date: 2022-07-29
LAM RES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in significant downtime as consumable parts must be properly reset in the chamber and chamber conditions must be adjusted prior to use

Method used

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  • Encapsulated radio frequency identification in consumable chamber components
  • Encapsulated radio frequency identification in consumable chamber components
  • Encapsulated radio frequency identification in consumable chamber components

Examples

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Embodiment Construction

[0031] Embodiments present methods, systems, and apparatus for embedding radio frequency (RF) tags within consumable parts, reading identification information from the RF tags, and using the identification information to track consumable parts. Tracking can be used to monitor to ensure that parts used in processing modules are genuine, to resolve processing issues, to determine how much life a part has left before consumable parts must be replaced, etc. The tracking of consumable parts can be done in situ without any downtime of the processing module. RF tags are tamper-resistant tags, thereby ensuring that the identification information and other characteristics of consumable parts are not altered and falsified. The location of the RF tags ensures that the information contained in the RF tags is accessible and that the identification information and other characteristics of the consumable parts can be read during the life of the consumable parts.

[0032] The RF tags may be ...

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PUM

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Abstract

A consumable component and a method of tracking a consumable component include embedding a radio frequency tag within a pocket defined on a side of the consumable component that avoids a processing area defined in the processing chamber; and covering the opening of the pouch with a plug. The plug is laser fused along an interface formed between a plurality of sidewalls of the plug and a plurality of sidewalls of the pocket.

Description

technical field [0001] Embodiments of the present invention relate to methods, systems and procedures for tracking consumable parts in semiconductor fabrication facilities. Background technique [0002] Substrates (eg, wafers, flat panels) are subjected to various types of processing to form electronic products such as integrated circuits, flat panel displays, and the like. The substrate is placed in a processing chamber and subjected to different processing operations, such as plasma etching, cleaning, deposition, etc., which expose the substrate surface to different chemicals. For example, during a plasma etch operation, selective portions of the substrate surface are exposed to the plasma. The selective portion is exposed by disposing a photoresist mask layer on the surface of the substrate and subjecting the substrate to a plasma etch such that the plasma etch removes the photoresist not covered material below. Similarly, the substrates may undergo cleaning in the sam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01J37/32B25J19/02H01L21/677H01L21/687
CPCH01J37/32908H01J37/32642H01J37/32431H01J37/32807H01L21/67294
Inventor 戈登·彭姜瑜大卫·切利史蒂夫·阿斯金
Owner LAM RES CORP