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Cantilever needle module for testing micro-spacing connector

A connector and cantilever technology, applied in the field of connector testing, can solve the problems of frequent maintenance and high test defect rate, and achieve the effect of contact conduction

Pending Publication Date: 2022-08-02
SUZHOU KELINYUAN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the deficiencies of the prior art, one of the objectives of the present invention is to provide a cantilever needle module for testing micro-pitch connectors, which can solve the problems of high test defect rate and frequent maintenance

Method used

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  • Cantilever needle module for testing micro-spacing connector
  • Cantilever needle module for testing micro-spacing connector
  • Cantilever needle module for testing micro-spacing connector

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Embodiment Construction

[0026] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, on the premise of no conflict, the embodiments or technical features described below can be combined arbitrarily to form new embodiments. .

[0027] It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be a centered component. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a co-existence of an intervening component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a co-existing centered component. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for illustrative purposes only.

[0028] Unless otherwise defined, ...

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PUM

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Abstract

The invention discloses a cantilever needle module for testing a small-spacing connector, which comprises a mounting seat, a plurality of cantilever needles, a matching seat, a probe fixing assembly, a limiting nail and a spring, and is characterized in that the matching seat is provided with a top protection groove, and each cantilever needle comprises a first connection section, a middle connection section and a second connection section used for being in contact test with a connector contact; the two ends of the middle connecting section are connected with the first connecting section and the second connecting section respectively; the first connecting sections of the cantilever needles are fixed to the probe fixing assembly, the second connecting sections are located above the top protection groove or in the top protection groove, the limiting nail penetrates through the mounting base, and the spring is located on the lower side of the mounting base. The mode that the second connecting section of the cantilever needle is in contact with the connector contact for testing is adopted, contact conduction is achieved, meanwhile, two probes can be in contact with one contact of the connector, and the problems that the test reject ratio is high, and frequent maintenance is needed are solved. In an actual test, the connector can be pressed down along the upper part of the matching seat.

Description

technical field [0001] The invention relates to the field of connector testing, in particular to a cantilever needle module for testing micro-spacing connectors. Background technique [0002] At present, after the connector is soldered to the FPC, it is necessary to perform a 4-wire accurate resistance test. Two probes need to be placed on the top of the connector, and two probes are placed on the PAD at the other end, forming a 4-wire loop. Test the connector to The precision resistance of PAD determines whether the soldering condition of the connector is good. [0003] However, existing connector tests suffer from the following flaws: [0004] Since the existing technology cannot place two probes on the top of the connector, one probe is placed on the top and one is placed on the solder leg. Since there is solder and flux on the solder feet, the probe on the solder feet adheres to the flux, and the contact is poor, and the flux and solder will block the probe hole, so th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073
CPCG01R1/073G01R1/07307
Inventor 赵志刚文东升
Owner SUZHOU KELINYUAN ELECTRONICS CO LTD
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