2results about How to "Solve the yield problem" patented technology

This invention provides a modular cooling plate structure comprising an assembly composed of multiple plates joined together. Each plate includes a concave surface and a flat surface. The concave surface has an inlet, an outlet, and a microchannel connecting the inlet and outlet. The flat surface of the plate covers the concave surface of an adjacent plate to form a continuous assembly. By using a very small joint gap between the concave surface and the four sides of the plate, the concave surface can obtain a large heat exchange area, thereby replacing the traditional water-cooled plate with shovel-tooth fins, which suffers from poor heat exchange due to the small heat dissipation area of ​​the shovel-tooth fins.

The present disclosure relates to a method, device, equipment, storage medium and product for checking device connection relationship. The method comprises: obtaining a standard format netlist file; obtaining a node level matching checking program; using the program to perform node level matching checking on the standard format netlist file to obtain a node with an error level matching and a device with an error level connection relationship. The embodiment of the present disclosure can check the node with the error level connection relationship and the device in the chip design, solve the error level driving problem by modifying the design or adding a level conversion circuit, and thus can solve the problem of chip performance not meeting the expectation, chip yield reduction or chip long-term failure from the design source.