4results about How to "Solve the yield problem" patented technology

The utility model relates to a feeding structure and a sorting machine, and relates to the technical field of sorting equipment. The feeding structure comprises a conveying device, a vibration feeding platform, a discharging groove and a pushing device. The conveying device is used for conveying products; the vibration feeding platform is arranged at one end of the conveying device, the vibration feeding platform comprises a fixed disc and a vibration disc rotationally arranged on the fixed disc, and the fixed disc is provided with a first side and a second side which are oppositely arranged in the width direction; the discharging groove is formed in the first side; the pushing device is arranged on the second side; in the working state, the pushing device pushes products on the vibration feeding platform to the vibration disc in the width direction, and the products are conveyed to the discharging groove through the vibration disc. According to the technical scheme, the automation degree can be improved, and the problems that due to the fact that manual material pushing force is not controlled, products topple over, the reject ratio of the appearance of the products is high, and materials are clamped and blocked are effectively solved.

The invention relates to the technical field of glass processing, and particularly discloses a glass laser cutting internal cracking device and method.The glass laser cutting internal cracking device comprises a base, and an internal cracking tool on the base is mainly composed of a pressing mechanism, an internal cracking mechanism and a stripping mechanism; glass is placed on the internal cracking jig, the internal cracking jig is heated and heats the glass to the required cracking temperature through heat conduction, the lower pressing mold of the stripping mechanism supports the lower surface of waste, the upper pressing mold of the lower pressing mechanism slowly pressurizes the upper surface of the glass waste, and meanwhile the stripping mechanism slowly descends; cooling the lower pressing mold and the upper pressing mold by using a cooling liquid, and refrigerating and cooling the glass waste through heat conduction, so that the glass finished product expands after being heated, the waste is contracted after being cooled, and the glass waste is separated from the peripheral finished product to complete splitting; the problems that the glass inner hole cracking efficiency is low and the edge breakage yield is low are solved, drilling separation treatment does not need to be carried out on the glass, dust is not generated in the whole glass machining process, and dust pollution to the glass and equipment is avoided.

This invention provides a modular cooling plate structure comprising an assembly composed of multiple plates joined together. Each plate includes a concave surface and a flat surface. The concave surface has an inlet, an outlet, and a microchannel connecting the inlet and outlet. The flat surface of the plate covers the concave surface of an adjacent plate to form a continuous assembly. By using a very small joint gap between the concave surface and the four sides of the plate, the concave surface can obtain a large heat exchange area, thereby replacing the traditional water-cooled plate with shovel-tooth fins, which suffers from poor heat exchange due to the small heat dissipation area of ​​the shovel-tooth fins.

The present disclosure relates to a method, device, equipment, storage medium and product for checking device connection relationship. The method comprises: obtaining a standard format netlist file; obtaining a node level matching checking program; using the program to perform node level matching checking on the standard format netlist file to obtain a node with an error level matching and a device with an error level connection relationship. The embodiment of the present disclosure can check the node with the error level connection relationship and the device in the chip design, solve the error level driving problem by modifying the design or adding a level conversion circuit, and thus can solve the problem of chip performance not meeting the expectation, chip yield reduction or chip long-term failure from the design source.