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Packaging structure of high-density display light source device of LED

A packaging structure and light source technology, which is applied in the direction of electric solid-state devices, semiconductor devices, instruments, etc., can solve the problems of small size, high production cost, and small size of the back pad, so as to improve stability, high production efficiency, and simplify complexity sexual effect

Inactive Publication Date: 2018-05-29
SHENZHEN JINGTAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) Encapsulation is difficult, and production yield and efficiency are low
The size is getting smaller and smaller, approaching the precision limit of packaging equipment, the production yield and efficiency are difficult to control, and equipment development cannot keep up, resulting in high production costs
[0005] 2) Ultra-small size SMD devices, the production yield and efficiency are low when the client is patched
[0006] 3) The size of the pad on the back is small, and the tin area is small, resulting in a small thrust force for LED bonding and poor anti-collision performance of the display screen, which is not conducive to the handling and use of the display screen
[0007] 4) It is difficult to realize the production of display screens with a pitch of less than 1.0mm for the SMD structure devices realized by the existing technology
[0008] 5) Due to the high density of LED light source devices with a pitch of less than 1.0 realized by the existing technology, it is difficult for the PCB board factory to control the design and arrangement of the circuit lines, the complexity is high, and the stability is poor

Method used

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  • Packaging structure of high-density display light source device of LED
  • Packaging structure of high-density display light source device of LED
  • Packaging structure of high-density display light source device of LED

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A light-emitting unit 3 with 2 rows*2 columns is provided by adopting copper foil hole cutting technology.

[0039] Such as figure 1 , 2 As shown, the front circuit line of the substrate 1 is connected to the back circuit line 2 through the copper wall of the 1 / 4 circular cut hole or 1 / 2 circular cut hole on the edge to realize the circuit connection. For the setting of the conductive hole 6, see figure 1 and figure 2 . There are 4 light-emitting units (that is, 2 rows and 2 columns) on the front pad of the substrate 11, and the distance between the four light-emitting units is 1mm; 8 pads 9 are set on the back, respectively controlling the negative electrodes of the red light chips in each row (2 rows in total) , the negative electrodes of the green chips in each row (2 rows in total), the negative electrodes of the blue chips in each row (2 rows in total), and the common positive electrodes in each column (2 columns in total).

[0040] Each light-emitting unit 3 ...

Embodiment 2

[0045] The second embodiment provides a light-emitting unit 3 with 2 rows*2 columns that adopts a copper pillar via technology structure.

[0046] Such as image 3 , 4 As shown, the circuit line 2 on the front side of the substrate 1 is connected to the line on the back side through the copper pillar hole to realize the circuit connection. image 3 and Figure 4 . 4 light-emitting units 3 (that is, 2 rows and 2 columns) are arranged on the front pad of the substrate 1, and the distance between the 4 light-emitting units 3 is 1 mm; 8 pads 9 are arranged on the back, respectively controlling the negative electrodes of the red light chips in each row (a total of 2 rows), the negative electrodes of the green chips in each row (2 rows in total), the negative electrodes of the blue chips in each row (2 rows in total), and the common positive electrodes in each column (2 columns in total).

[0047] Each light-emitting unit 3 is provided with 3 chips, which are respectively 1 red ...

Embodiment 3

[0052] Such as Figure 5 , 6 As mentioned above, on the basis of the second embodiment, the third embodiment adopts the inkjet printing technology to perform inkjet treatment on the metal pad after the wire bonding, the ink is black ink, and the thickness of the ink layer 8 is 50-150um. The surface contrast of the device treated by the ink-jet technology is significantly improved, and the thick ink can prevent light crossing and mutual interference among the light-emitting units 3 and improve the fidelity of the displayed color. Seal the semi-products after inkjet with transparent glue to protect the light-emitting chip 4. The transparent glue can be realized through traditional molding and dispensing processes, or through inkjet printing, 3D printing and other technologies. The thickness of the glue can be 0.3-0.8 mm.

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Abstract

The invention discloses a packaging structure of a high-density display light source device of an LED. The packaging structure is composed of a substrate, a circuit arranged on the substrate and a packaging adhesive. The circuit includes a front-side circuit part arranged at the front side of the substrate and a back circuit part arranged at the back of the substrate. Conduction holes for connecting the front-side circuit part and the back circuit part are formed in the substrate; the walls of the conduction holes are plated with conductive materials; the conduction holes are filled with conductive materials or non-conductive materials. The front-side circuit part includes at least two light-emitting units; a light-emitting chip is arranged in each light-emitting unit; and the light-emitting chips and the substrate are in conduction through bonding wires. The disclosed packaging structure has advantages of high reliability and low cost; and the high-density display function with the pixel interval of 0.5 to 1.3mm can be realized.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a packaging structure of LED high-density display light source devices. Background technique [0002] With the continuous improvement of indoor display application technology, the technology of traditional display products has gradually reached the top, and indoor small-pitch products will become the main space for technological development in the future; in order to replace LCD and DLP indoor high-definition display products, the pixel density requirements of indoor small-pitch display screens are getting higher and higher. higher. Therefore, the requirements for the small-pitch LED packaging structure are getting higher and higher. [0003] At present, the main product of SMD LED represented by packaging factories is 1010. 1010 can realize a display screen with a pixel pitch of 1.25mm-2.0mm, but it cannot achieve a display pitch below 1.25 mm. At the same time, various p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075G09F9/33
CPCH01L25/0753G09F9/33
Inventor 龚文邵鹏睿沈振辉
Owner SHENZHEN JINGTAI
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