Flexible circuit board, and mechanism and method for connecting flexible circuit board and printed circuit board

A flexible circuit board and printed circuit board technology, which is applied in the structural connection of printed circuits, the formation of electrical connections of printed components, and the assembly of printed circuits with electrical components, can solve problems such as poor reliability and unreasonable connection structure between FPC and PCB. Achieve good reliability and improve reliability

Inactive Publication Date: 2011-01-12
HUAWEI DEVICE CO LTD
View PDF9 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of poor reliability caused by the unreasonable connection structure between FPC and PCB in the prior art, the embodiment of the present invention provides a flexible circuit board, a connection mechanism between a flexible circuit board and a printed circuit board, and a manufacturing method for a flexible circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible circuit board, and mechanism and method for connecting flexible circuit board and printed circuit board
  • Flexible circuit board, and mechanism and method for connecting flexible circuit board and printed circuit board
  • Flexible circuit board, and mechanism and method for connecting flexible circuit board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The embodiment of the present invention proposes a flexible circuit board, the structure of which is as follows figure 2 As shown, it includes a first body 11 of a flexible circuit board and a bending head 12; the bending head 12 is arranged side by side with the first body 11 of the flexible circuit board and forms a bending portion 13; the surface of the bending portion 13 Pads 14 are provided.

[0028] The embodiment of the present invention proposes a flexible circuit board, in which a bent part is formed, and pads are arranged on the surface of the bent part. In this way, compared with the single-sided FPC in the prior art, the pads of the FPC can be soldered to the pads on the surface of the PCB by manual welding or other welding methods. During soldering, the pads on the surface of the bent part and the pads on the surface of the PCB can be soldered together very simply, so as to reduce the difficulty of soldering and reduce the cost. At the same time, the FPC...

Embodiment 2

[0030] The second embodiment of the present invention proposes a flexible circuit board, the structure of which is as follows image 3 and Figure 4 As shown, it includes a first body 11 of a flexible circuit board and a bending head 12; the bending head 12 is arranged side by side with the first body 11 of a flexible circuit board and forms a bending portion 13; the U-shaped bending portion 13 is provided with pads 14 on the surface.

[0031] The bending head may be formed by bending one end of the flexible circuit board.

[0032] Wherein, the bent portion 13 is U-shaped. Of course, this is only an illustration of the embodiment of the present invention, and the bending portion can also be in other shapes, such as a V shape, which is not limited in the embodiment of the present invention.

[0033] Such as image 3 As shown, the pad 14 can extend a predetermined distance along the surface of the bending head 12, so that the contact area between the pad 14 and the pad on th...

Embodiment 3

[0039] The third embodiment of the present invention proposes a method for manufacturing a flexible circuit board, including:

[0040] A bending portion is formed between the first body of the flexible circuit board and the bending head, and a welding pad is formed on the surface of the bending portion.

[0041] The embodiment of the present invention proposes a method for manufacturing a flexible circuit board, which can form a bent portion of the flexible circuit board, and the surface of the bent portion has a welding pad. Compared with the single-sided FPC in the prior art, the flexible circuit board manufactured by adopting the method of the embodiment of the present invention can simply weld the pads of the FPC to the pads on the surface of the PCB by manual welding or other welding methods. During soldering, the pads on the surface of the bent portion and the pads on the surface of the PCB can be soldered together very simply; so as to reduce the difficulty of soldering...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a flexible circuit board and a mechanism and a method for connecting the flexible circuit board and a printed circuit board, and belongs to the technical field of machinery. One end of the flexible circuit board is bent to form a U-shaped bending part, and a bonding pad is arranged on the surface of the U-shaped bending part. Therefore, the bending part is adhered to the printed circuit board, and the bonding pad on the surface of the U-shaped bending part and a bonding pad on the surface of the printed circuit board are opposite and welded. The invention can improve the connecting reliability, and can effectively solve the problems of low yield and low reliability for manually welding a low-cost single-sided FPC. Meanwhile, the welding spots of the connecting structure can be clearly seen, and the welding defect can be discovered through appearance inspection. Therefore, the mode has high reliability.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to a flexible circuit board, a connection mechanism between the flexible circuit board and the printed circuit board, and a manufacturing method of the flexible circuit board. Background technique [0002] With the development of electronic technology, the volume of mobile terminals is getting smaller and smaller to meet the requirements of mobility and portability. At the same time, due to the increase in product diversification and complexity, interconnection methods between FPC (Flexible Printed Circuit, flexible printed circuit board) and PCB (Printed Circuit Board, printed circuit board) in the mobile terminal are also various. [0003] The existing connection method between FPC and PCB can be as follows: figure 1 As shown, a PCB pad 101 is provided on the PCB board 100 , and an FPC pad 201 is provided on the FPC 200 . The FPC pad 201 and the PCB pad 101 are arranged corr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/00H05K3/40H05K1/14H05K3/36
Inventor 米青霞王勇
Owner HUAWEI DEVICE CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap