Manufacturing method of weakening structure and transfer method of micro device

A production method and transfer method technology, applied in the field of mass transfer, can solve the problems of difficult transfer, low yield, weakened structure micro-devices, etc., and achieve the effect of solving difficult and small transfer and reducing damage

Active Publication Date: 2021-06-15
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the deficiencies in the prior art above, the purpose of this application is to provide a method for fabricating a weakened structure and a transfer method for micro devices, aiming to solve the problems of high transfer difficulty and low yield in the mass transfer process in the prior art

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  • Manufacturing method of weakening structure and transfer method of micro device
  • Manufacturing method of weakening structure and transfer method of micro device
  • Manufacturing method of weakening structure and transfer method of micro device

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Embodiment Construction

[0033] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0035] In order to reduce the difficulty of micro-device transfer and improve the...

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Abstract

The invention relates to a manufacturing method of a weakening structure and a transfer method of micro devices. The manufacturing method of the weakening structure comprises the following steps of: providing a first transient substrate adhered with a plurality of micro devices; depositing sacrificial layers on the surfaces of the micro devices and the surface of one side, adhered with the micro devices, of the first transient substrate; patterning the sacrificial layers to expose part of the surfaces of the micro devices; depositing brittle material connecting layers on the residual sacrificial layers and the partial surfaces of the micro devices; adhering the brittle material connecting layers to the surface of one side of a second transient substrate; and removing the first transient substrate and the residual sacrificial layers, so that the micro devices are fixed on the second transient substrate through the brittle material to form the weakening structure. According to the manufacturing method of the weakening structure and the transfer method of the micro devices of the invention, the problems of high transfer difficulty and low yield in the mass transfer process are effectively solved.

Description

technical field [0001] The invention relates to the technical field of mass transfer, in particular to a method for fabricating a weakened structure and a method for transferring micro devices. Background technique [0002] Micro LED (Micro Light Emitting Diode, Micro Light Emitting Diode) is a new generation of display technology. Better performance with both low power consumption and long life. During the manufacturing process of micro light emitting diodes, tens of millions of Micro LEDs need to be peeled off from the growth substrate, and then these Micro LEDs are transferred to the target substrate. Mass transfer is a key point of technological breakthrough, and its process mainly includes laser stripping, mass transfer, and inspection and repair processes. [0003] The process of stripping the Micro LED from the growth substrate is mainly as follows: First, use a temporary bonding material to temporarily bond the Micro LED to the transient substrate, and then use las...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L21/683
CPCH01L21/6835H01L33/48H01L2221/68322H01L2933/0033
Inventor 邓霞许时渊崔丽君唐彪
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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