Wafer probe card and wafer detection equipment

Abstract

The invention relates to the field of electronic integrated circuit detection, and particularly discloses a wafer probe card and wafer detection equipment, which comprise a device probe and a monitoring probe cluster, the monitoring probe cluster comprises a main probe and a first auxiliary probe; the lowest end of the first auxiliary probe is higher than the device probe, and the lowest end of the main probe is lower than the device probe; after the main probe is in contact with the wafer to be tested, the main probe slides along a first direction along with the continuous downward pressing of the wafer probe card, and when the main probe is in contact with the wafer to be tested and the distance between the wafer probe card and the wafer to be tested is continuously shortened by a first distance, the main probe slides along a second direction along with the continuous downward pressing of the wafer probe card. And the main probe is in contact connection with the first auxiliary probe to form an alarm loop. According to the wafer probe card, the probe on the wafer probe card is prevented from being bent, the service life of the wafer probe card is guaranteed, and the wafer probe card is low in equipment cost, convenient to use, low in circuit transformation cost and high in universality.

Description

technical field [0001] The invention relates to the field of electronic integrated circuit inspection, in particular to a wafer probe card and wafer inspection equipment. Background technique [0002] Wafers of photonics and electronic integrated circuits are usually inspected at the wafer level before they are divided into chips and packaged into products. Wafer-level inspection is of great significance for reducing the cost of chip inspection, ensuring the quantity rate of products, and the company's control of product costs. At present, the detection of devices on wafers using probe cards is a very common method in today's semiconductor device testing. In addition, in the chip test, the connection of electrical signals can be realized by way of gold wire bonding or by way of probe card pressing. After the gold wire-bonded chip is tested, if the gold wire ball bonded to the metal electrode plate is removed, it will cause certain damage to the metal electrode plate of the...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a wafer probe card and wafer detection equipment, which has solved the problems of high cost, cumbersome installation and debugging process and inconvenient use of the method for monitoring the distance between the probe card and the wafer in the prior art