Semiconductor chip packaging structure and packaging method thereof

Abstract

The invention discloses a semiconductor chip packaging structure and a packaging method thereof, relates to the technical field of semiconductor chip packaging, and solves the problem that the operation flow of dismounting and mounting semiconductor chips in an upper packaging plate and a lower packaging plate by an operator is very slow. The semiconductor chip packaging structure comprises a lower packaging plate, an upper packaging plate is arranged at the upper end of the lower packaging plate in a clamped mode, matched connecting mechanisms are fixedly welded to the two sides of the upper end of the lower packaging plate correspondingly, insertion fixing mechanisms are arranged on the two sides of the two matched connecting mechanisms in an inserted mode correspondingly, and the upper packaging plate and the lower packaging plate are fixedly welded to the upper end of the lower packaging plate correspondingly. The front side and the rear side of the surface of the inserting fixing mechanism are each provided with two rib plates in a matched mode. The clamping blocks are fixedly welded to the two sides of the insertion fixing mechanism, the elastic clamping strips are fixedly welded to the upper side and the lower side of one side of each clamping block, and the whole insertion fixing mechanism transversely moves towards one side, so that the middle of the transverse end of one side of the insertion fixing mechanism can be clamped in the two elastic clamping strips.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip packaging, in particular to a semiconductor chip packaging structure and a packaging method thereof. Background technique [0002] With the rapid development of society and economy, the casing for installing semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip and the external circuit - the on-chip The contacts are wired to the pins of the package, which in turn are connected to other devices by wires on the printed board. Therefore, packaging plays an important role for both CPU and other LSI integrated circuits. [0003] However, most of the existing semiconductor chip packaging structures are connected and fixed by bolts and nuts, which makes operators need to use tools such as screwdrivers to disassemble or install the...

AI Technical Summary

Problems solved by technology

[0003] However, most of the existing semiconductor chip packaging structures are fixed by bolts and nuts, which makes operators need to use tools such as screwdrivers to disassemble and install the semiconductor chips inside the upper packaging board and the lower packaging board. Its operation process is very slow, which is not conducive to rapid operation

Therefore, it does not meet the existing needs, so we propose a semiconductor chip packaging structure and packaging method

Images