Image sensor chip, method for manufacturing the same, and image sensor and base plate thereof

Abstract

an image sensor chip, wherein a prescribed number of photoelectric conversion elements 28, analog switches 29 which are respectively connected in series with the elements 28, a switching circuit 30 which successively turns on the switches 29 by using clock signals, output loads 31 and 40 which are commonly connected in series with each set of one photoelectric conversion element (28) and its corresponding analog switch 2), an amplifier circuit 32 which amplifies the potentials on the element side of the loads, and, preferably, a resistor R for adjusting the gain of the circuit 32 are integrally assembled as a light receiving section. The gain adjusting resistor R is provided with a plurality of resistors Ra1, Ra2, Ra3, Ra4, Rb1, Rb2, Rb3, and Rb4 connected in series and disconnectable by-pass lines 50 provided for all or part of the resistors.

Description

technical field [0001] The invention relates to an image sensor chip, a manufacturing method thereof and an image sensor. Background technique [0002] A conventional image sensor 10 generally used in an image reading unit of a facsimile machine or an image scanner device has a configuration as follows: Figure 11 shown. [0003] A plurality of image sensor chips 13 are mounted on a base plate 12 disposed on the bottom surface of a case 11 made of resin or the like within a length corresponding to the reading width. A glass cover 14 is installed on the top of the housing 11, and a rod lens array 15 is arranged between the reading line L set on this glass cover 14 and the above-mentioned image sensor chip 13, in order to make the reading line L along the reading line The bright and dark images on L are focused equally on the image sensor chip array. A plurality of LEDs 16 serving as light sources are also arranged in the inner space of the casing 11 , and these LEDs are mou...

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Problems solved by technology

[0010] For this, as Figure 11 As shown, as the base plate 12, it is necessary to use the mode of wiring both inside and outside, and its production and component loading work become complicated. The inner surface of the base plate 12 will be uneven due to the above-mentioned various components. In addition to making the image The appearance of the sensor chip is deteriorated, and the space required for disposing the image sensor in the thickness direction is increased, hindering the miniaturization of the machine equipped with such an image sensor.

[0011] The 2nd, in addition to the above-mentioned image sensor chip on the bottom plate, also need to load multiple electronic components such as IC, capacitor, resistor or variable resistors for adjusting the gain of the amplifying circuit that constitute the amplifying circuit, therefore, the problem that produces is that the The manufacturing process of substrates for sensors becomes complicated

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