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Method and apparatus for wireless testing of integrated circuits

A technology for testing circuits and integrated circuits, applied in the direction of measuring devices, circuits, measuring electricity, etc.

Inactive Publication Date: 2004-11-10
天工方案公司地址
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, physical size often limits the number of input and output leads that can be included on a packaged chip

Method used

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  • Method and apparatus for wireless testing of integrated circuits
  • Method and apparatus for wireless testing of integrated circuits
  • Method and apparatus for wireless testing of integrated circuits

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0029] A system for testing integrated circuit or microelectronic circuit devices such as figure 1 shown. The system includes a test bed 20 for mounting a microelectronic circuit ( figure 1 not shown). The test bed includes a surface 22 . The surface 22 may be substantially horizontal, although other orientations are possible. The surface 22 may be supported by a support mechanism, such as legs 24 .

[0030] The test bed 20 is electrically connected to a signal source and signal analyzer. The signal source and analyzer can be a single computer 30, for example, a programmed electronic microcomputer. The connection between the test bed 20 and the computer 30 is described below.

[0031] pass figure 1 The microelectronic device tested by the shown apparatus may take the form of a packaged device 40, such as figure 2 shown, or a bare chip such as Figure 5 Chip 60 is shown. Other types of packaging are also available in the industry and may enclose the microelectronic c...

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PUM

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Abstract

A system for testing a microelectronic circuit includes a test bed for mounting a microelectronic circuit, and a signal source for applying a signal to a microelectronic circuit mounted on the test bed. The system additionally includes a test probe for wirelessly receiving electromagnetic response signals from the microelectronic circuit mounted on the test bed. In a preferred form, the electromagnetic response signals are radio-frequency signals. The test system additionally includes a computer connected to the test probe for analyzing the electromagnetic response signals. An integrated circuit for testing on the test system has a test circuit portion that emits electromagnetic radiation in response to a predetermined signal applied to the test circuit.

Description

technical field [0001] The present invention relates to testing microelectronic circuits, such as semiconductor integrated circuits. Background technique [0002] Electronic circuits, including semiconductor integrated microelectronic circuits, are tested during and after the manufacturing process. Testing is verifying that the circuit is accurately fabricated and functions properly. [0003] Test circuits are sometimes included in the design of an integrated circuit. These test circuits are designed to produce specific responses to known inputs. In addition, test points are built into the circuit so that signals in the circuit can be monitored during testing. [0004] Electrical paths are provided to test circuits and test points so that supervisory signals can be detected. Also, in some cases, the tester may be required to supply specific known test inputs to the test circuit or a specific point in the circuit so that a specific function can be tested. [0005] Each o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/302G01R31/28G01R31/311H01L21/822H01L27/04
CPCG01R31/2884G01R31/311G01R31/3025H01L2924/0002H01L2924/00
Inventor 斯担利·A·怀特肯尼思·S·沃利詹姆斯·W·约翰斯顿P·迈克尔·亨德森小沃纳·B·安德鲁斯乔纳森·I·西安凯利·H·黑尔
Owner 天工方案公司地址