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Microporous copper film and electroless copper plating solution for obtaining the same

A microporous and film-coated technology, which is applied in liquid chemical plating, transportation, packaging, coating, etc., can solve the problems of dissolution, halo bleeding, and poor graphic accuracy of etching protective film, and achieve high heat resistance and high Effect of Adhesive Strength

Inactive Publication Date: 2005-06-01
EBARA-UDYLITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is necessary to conduct electricity between the layers of the multi-layer laminated board manufactured in this way. For this reason, it is necessary to drill holes in the laminated board and then perform through-hole plating. The infiltration of the acidic solution used, or the infiltration of the plating solution in the electroless copper plating process, will dissolve the copper oxide or cuprous oxide coating, resulting in a phenomenon called pink ring (halo bleeding), which is its disadvantage.
[0004] On the other hand, since the wiring of the printed circuit board is formed by using a copper-clad laminate made of a copper foil that has been roughened in advance, the process of roughening the surface of the copper foil and forming an oxide film can be omitted. However, according to this method, since the surface of the copper foil has been roughened, there is a problem that the pattern accuracy of the printed etching protective film or the etching protective film by the ultraviolet irradiation method is deteriorated.

Method used

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  • Microporous copper film and electroless copper plating solution for obtaining the same
  • Microporous copper film and electroless copper plating solution for obtaining the same
  • Microporous copper film and electroless copper plating solution for obtaining the same

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Preparation of electroless copper plating solution (1):

[0035] Prepare the electroless copper plating solution according to the following composition and the conventional method.

[0036] (composition)

[0037] Copper sulfate 0.032mol / l

[0038] Sodium citrate 0.052mol / l

[0039] Sodium hypophosphite 0.270mol / l

[0040] Boric acid 0.500mol / l

[0041] Nickel sulfate 0.0024mol / l

[0042] Surfinol 104 * 1.0g / l

[0043] pH 9.0

[0044] * : Nissin Chemical Industry Co., Ltd.

[0045] Using this electroless copper plating solution, an inner layer copper-clad laminate (FR-4; epoxy resin) was electrolessly plated at 60°C for 30 minutes. When the obtained copper coating film was observed using a scanning electron microscope, it was found that the copper coating film had many micropores as shown in FIG. 1.

Embodiment 2

[0047] Bonding strength with resin substrate:

[0048] The adhesive strength of the microporous copper film of the present invention on various resin substrates can be evaluated by the following method, that is, after electrolytic copper plating is applied to the resin substrate according to the composition of Example 1, it is passed through a prepreg The blanks were pressed to form a multilayer board in this way, and then evaluated by measuring the peel strength of the multilayer board.

[0049] As a result, in the case of FR-4, the obtained strength is 1.2kgf / cm, and in the case of BT-800 resin (bismaleimide triazine) it is 0.7kgf / cm, which can be obtained by blackening treatment High bonding strength. In addition, in the case of PPE-S resin (polyphenylene ether), the adhesion force can hardly be obtained by the blackening treatment, but in the case of forming the microporous copper film of the present invention, 0.2kgf / cm的adhesion.

[0050] As described above, the microporous cop...

Embodiment 3

[0052] Preparation of electroless copper plating solution (2):

[0053] Prepare the electroless copper plating solution according to the following composition and the conventional method.

[0054] (composition)

[0055] Copper sulfate 0.032mol / l

[0056] Sodium citrate 0.052mol / l

[0057] Sodium hypophosphite 0.270mol / l

[0058] Boric acid 0.500mol / l

[0059] Nickel sulfate 0.0024mol / l

[0060] Surfinol 104 * 1.0g / l

[0061] Surfinol 465 * 0.1g / l

[0062] pH 9.0

[0063] * : Nissin Chemical Industry Co., Ltd.

[0064] Electroless copper plating was performed on the copper-clad laminate (FR-4) for the inner layer in the same manner as in Example 1, and the adhesive strength was measured to be 1.3kgf / cm. When observed with a scanning electron microscope, it was found that Small needle-like crystals are formed on the entire surface of the inner side.

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PUM

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Abstract

Disclosed in every 1cm 2 A metal copper coating with 100,000 to 1 billion micropores in an area and a plated product with such a coating. This metal copper coating can be prepared by immersing the plated object in an electroless copper plating solution containing copper ions, complexing agents, hypophosphorous acid compounds, metal catalysts for initiating reduction reactions and compounds containing acetylenic bonds.

Description

Technical field [0001] The present invention relates to a metal copper coating film with microporosity, and more specifically, to a metal copper coating film with many micron-sized micropores, an electroless copper plating solution for forming the copper coating film, and a metal copper coating film having microporosity. Film coated products. Background technique [0002] So far, multilayer printed circuit boards have been prepared according to the following method, that is, first prepare copper clad laminates for the inner layer by preparing copper foils on the copper clad laminates and forming lines on the printed circuit boards, and then prepare the copper clad laminates for the inner layer. The copper foil is subjected to surface pretreatment (usually degreasing first, and then soft etching treatment and activation treatment with a system represented by ammonium persulfate, sodium persulfate, copper chloride, sulfuric acid-hydrogen peroxide, etc.) to make the surface rough Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
CPCC23C18/40Y10T428/12514Y10T428/12903C23C18/1648
Inventor 本间英夫藤波知之海老名延郎
Owner EBARA-UDYLITE CO LTD