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Over-temp. warning device

The technology of a storage device and a warning device is applied in the field of a temperature indicating structure indicating that a product has reached a critical temperature, and can solve the problems of inoperable electronic monitoring device, difficult attachment of the monitoring device, high cost and the like, and achieve easy operation, Simple operation, low cost effect

Inactive Publication Date: 2005-08-03
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A possible disadvantage of these electronic monitoring devices is that they tend to have high cost
Another disadvantage is that these monitoring devices are not easily attached to or detached from the device being monitored
Additionally, these electronic monitoring devices cannot operate independently of the device being monitored

Method used

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  • Over-temp. warning device
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  • Over-temp. warning device

Examples

Experimental program
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Effect test

Embodiment Construction

[0019] figure 1 is a perspective view of the package 100 to which a critical temperature indicator 110 may be attached. figure 1 Denotes a package 100 for holding one or several temperature sensitive items. The temperature sensitive item may be an electronic device. These include memory devices such as integrated circuit elements or PCMCIA (Personal Computer Memory Card International Association) cards and MRAM cards and the like. The package 100 may also contain other known temperature sensitive items or components.

[0020] Figure 2A is a perspective view of a memory card or chip 120 with a critical temperature indicator 110 attached thereto. The memory card 120 may be an MRAM card or a PCMCIA card or any other electronic card or electronic component such as an integrated circuit. A critical temperature indicator 110 is attached to the card 120 .

[0021] Figure 2B is a cross-sectional view of a package with a viewing window. In this embodiment, a memory card or ch...

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PUM

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Abstract

A critical temperature warning apparatus and method to monitor the thermal history of a product such as a memory card. The apparatus comprises a critical temperature indicator, which is externally attached to a product to be monitored. The indicator indicates if the product has experienced a critical temperature. The critical temperature indicator may comprise a patterned array of wax, the wax having a melting point equal to the critical temperature. If the pattern of wax has been destroyed leaving a molten wax residue, then this indicates that the product has experienced a critical temperature. The critical temperature indicator may also include thermographic inks for indicating that a critical temperature has been experienced.

Description

technical field [0001] The present invention generally relates to a temperature indicating structure, and more particularly to a temperature indicating structure for indicating that a product has reached a critical temperature. Background technique [0002] Many electronic components are routinely subject to detrimental temperature variations. For example, electronic storage devices fabricated using thin-film processes. These processes generally utilize temperature sensitive fabrication methods. These fabrication processes also involve the placement of metallic or organic materials. Generally speaking, once a metallic material or an organic material is placed, the memory device is no longer able to withstand temperatures greater than the critical temperature. When the temperature rises above a critical value, metals placed under low-temperature manufacturing processes may melt, one or a few thin layers may change properties, different materials may interdiffuse, and organ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K11/16G01K11/06G01K11/12G09F3/00G09F3/02G09F3/10
CPCG01K11/06G01K11/12
Inventor F·A·佩尔纳T·安索尼M·布哈他查尔亚
Owner SAMSUNG ELECTRONICS CO LTD