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Solid device and solid imaging unit and their production method and imaging device

A solid-state imaging and device technology, which is applied in the fields of electric solid-state devices, semiconductor devices, and semiconductor/solid-state device components

Inactive Publication Date: 2007-05-02
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Even for position adjustment based on X, Y, and θ axes, this technique has the inconvenience of requiring a position adjustment jig with pins protruding from it, and an additional step of alignment with this position adjustment jig

Method used

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  • Solid device and solid imaging unit and their production method and imaging device
  • Solid device and solid imaging unit and their production method and imaging device
  • Solid device and solid imaging unit and their production method and imaging device

Examples

Experimental program
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Embodiment Construction

[0037] Hereinafter, the solid-state imaging unit of the present invention will be described by way of example with reference to the accompanying drawings.

[0038] FIG. 1 is an exploded perspective view showing the assembly of a solid-state imaging unit 1 according to one example of the present invention.

[0039] As shown in Figure 1, the solid-state imaging unit 1 includes: a solid-state imaging device 2, which includes a solid-state imaging element 21 installed therein (it will be introduced in conjunction with Figure 2 hereinafter); a lens cylinder unit 3 positioned on the solid-state imaging element 21 , which includes a lens 31 that can focus light representing a captured image; and a wiring board 4 that transmits an output signal from the solid-state imaging element 21 to an external device. These elements are arranged and assembled to have an optimal positional relationship with each other.

[0040] 2A and 2B, the solid-state imaging device 2 includes a solid-state im...

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PUM

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Abstract

A solid state imaging device includes a package substrate; and a solid state imaging element mounted on the package substrate. The package substrate has a mounting plane on which the solid state imaging element is mounted. The package substrate has two reference planes having the same height as the mounting plane, the reference planes projecting in two opposite directions from the mounting plane. Reference planes respectively have at least one pair of positioning reference holes formed therein, such that the centers of the pair of holes are away from the center of the center of an imaging plane of the solid state imaging element by the same distance.

Description

technical field [0001] The present invention relates to a solid-state imaging device including a solid-state imaging element installed on a packaging substrate and a production method thereof, a solid-state imaging unit including a lens column unit connected to a solid-state imaging device and a production method thereof, and imaging devices employing them. Background technique [0002] Conventionally, solid-state imaging elements including CCDs are used in various types of imaging devices such as digital still cameras and video cameras. When used in these imaging devices, the solid-state imaging element is combined with a lens cylinder unit located thereon that includes an optical lens for focusing light representing an image. [0003] FIG. 4 shows a way of combining the solid-state imaging element 100B and the lens cylinder unit. The optical axis L of the optical lens 100A of this lens cylinder unit and the center C of the imaging surface of the solid imaging element 100...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H04N5/335G02B7/02H01L23/02H01L27/14H04N25/00
CPCH04N5/2254H01L27/14618H04N5/2253H01L2924/0002H04N23/55H04N23/54H01L2924/00H01L27/146
Inventor 宫崎京士工藤康仁佐佐木公英
Owner SHARP KK