Multi-channel surface stick welding spot fatigue state real-time monitoring system

Abstract

The invention relates to a multichannel surface mounted soldered dot fatigue state real-time monitoring system, composed of SMT chip circuit board, resistance voltage multichannel converting circuit board, connector, I / O collecting board and computer, a transistor DC voltage stabilizing supply power supplies power to the monitoring system, the SMT chip circuit board acts as the monitored object, the SMT soldered dots are connected in a Chinese character 'hui' shape, leading heads of each loop as well as lead wires connected with SMT chip and soldered dots are all connected to the converting circuit board, forming a corresponding circuit, the converting circuit board is connected with the collecting board by the connector, the collecting board is inserted in a socket on the PC mainboard, and then the monitoring monitors switch-on and-off of each loop with SMT soldered dots by virtual apparatus in the PC. It can monitor many channels and the monitoring results can accurately and real-timely reflect the fatigue state of SMT soldered dots.

Description

Technical field: [0001] The invention relates to a multi-channel real-time monitoring system, in particular to a multi-channel real-time monitoring system for the fatigue state of surface mounting solder joints. The invention belongs to the technical field of electronic packaging reliability monitoring. Background technique: [0002] Surface Mount Technology (SMT for short) was called the "electronic packaging technology revolution" in the 1990s. It has many advantages and has been widely used in important industrial fields such as aviation, aerospace, and ships. But it also has a fatal weakness - SMT solder joints have limited life and poor reliability. Low-cycle thermal fatigue failure and fatigue failure caused by vibration shock are the main failure reasons. How to judge the fatigue failure of SMT solder joints has been perplexing scientific and technological workers and many engineers and technicians. There are four main types of existing SMT solder joint fatigue fai...

AI Technical Summary

Problems solved by technology

Compared with the first three methods, this method eliminates the influence of human factors, has better real-time performance, low price of external circuits, and high measurement accuracy, but the operability is not good, and multi-channel measurement cannot be formed.

[0007] Judging from the first three criteria for judging fatigue failure of SMT solder joints, it is difficult to operate in actual engineering, and it is almost impossible to realize real-time monitoring. It is often a posteriori result. When the monitoring result is obtained, the engineering accident has already occurred.

Compared with the first three judgment criteria, the fourth judgment standard does have great engineering practicability and real-time performance, but it is often more complicated to operate, and the instruments are more expensive, so it is difficult to popularize and apply in engineering practice.

Images