Multi-layer structure unit and its manufacturing method

A multi-layer structure and component technology, which is applied in the direction of multi-layer circuit manufacturing, printed circuit components, semiconductor/solid-state device components, etc., can solve the problem of inability to form high-precision, difficult to fix mother substrates, multi-layer structure components 23 yields low level problem

Inactive Publication Date: 2007-08-08
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the warping of the laminate, similarly to the above, there arises the problem that it is difficult to fix the mother substrate, or that it is impossible to form the conductor pattern 21 with high precision.
In addition, when dividing the mother substrate for each multilayer structural member 23, the mother substrate cannot be divided according to the setting, and many defective products of the multilayer structural member 23 are formed, resulting in a problem that the yield of the multilayer structural member 23 is low.

Method used

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  • Multi-layer structure unit and its manufacturing method
  • Multi-layer structure unit and its manufacturing method

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Embodiment Construction

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0018] As shown in Fig. 1 (g), the multilayer structure part 1 of this embodiment has the mode of forming conductor pattern 3 and insulating layer 4 by cross lamination on the surface side of insulator substrate 2, and the most important feature is that a plurality of insulators At least one of the layers 4 ( 4 a , 4 b , 4 c , 4 d ) is made of an insulating material having a different thermal expansion ratio from the other insulating layers 4 .

[0019] Hereinafter, a specific configuration of the multilayer structure member 1 of this embodiment will be described together with an example of a manufacturing process. For example, first, an insulator substrate 2 as shown in FIG. 1( a ) is prepared. The insulating substrate 2 is made of, for example, an alumina substrate or a glass substrate. On the upper surface of the insulating substrate 2, a conductor pattern 3 (3a) i...

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Abstract

The purpose of the present invention is to correct the warpage of multilayer composite 5 in the process of alternatively forming conductor pattern 3 and insulation layer 4 on the insulation body substrate 2. In the process of alternatively forming conductor pattern 3 and insulation layer 4 on the insulation body substrate 2, the constituting material of the insulation layer is modified to be the other insulation material which can correct the warpage of the multilayer composite 5 according to the predetermined schedule, or in the forming step to constitute the multilayer composite 5 by the insulation substrate 2, conductor pattern 3 and insulation layer 4. Thus, the insulation layer 4 is formed, and thereby the warpage of the multilayer composite 5 can be corrected with high accuracy.

Description

technical field [0001] The invention relates to a multi-layer structural component made by laminating conductor patterns and insulating layers on an insulating substrate and a manufacturing method thereof. Background technique [0002] As one of the electronic components, there is a multilayer structural component composed of sequentially laminating conductor patterns through insulating layers on an insulator substrate. This multilayer structural member can be produced as follows (for example, refer to Patent Documents 1 and 2). For example, as shown in FIG. 2(a), a conductor pattern 21 is formed on an insulator substrate 20 with a conductor paste or the like, and then the conductor pattern 21 is sintered and the insulator pattern 21 and the conductor pattern 21 are cooled. The conductive pattern 21 shrinks during sintering, and the insulating substrate 20 and the conductive pattern 21 shrink during cooling. Since the conductor pattern 21 has a greater thermal contraction ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/03H05K3/46H01L23/15
Inventor 户波与之杉山雄二伊波通明
Owner MURATA MFG CO LTD
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