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Multi-layer ceramic substrate and its preparing process

A technology of multi-layer ceramics and substrates, applied in the direction of multi-layer circuit manufacturing, manufacturing tools, ceramic molding machines, etc., can solve the problem of impossible to overcome local residual stress, pressure application, etc.

Inactive Publication Date: 2002-07-03
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And it's nearly impossible to apply pressure evenly across the green sheet stack with any type of elastic
[0009] That is, it is almost impossible to overcome the problem of localized residual stress in a method of trying to apply pressure uniformly to a green sheet stack having cavities

Method used

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  • Multi-layer ceramic substrate and its preparing process
  • Multi-layer ceramic substrate and its preparing process
  • Multi-layer ceramic substrate and its preparing process

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0066] In a first example, fabrication and calcination have figure 1 The green sheets of the shown structure are stacked to obtain a figure 2 The multilayer ceramic substrate of the structure shown. As a green stack, a multilayer master stack is fabricated, which can be divided into several multilayer ceramic substrates.

[0067] First, in order to obtain a stack of 100 mm square green sheets with multiple cavities distributed, a first ceramic green sheet with multiple openings and a second ceramic green sheet without openings were prepared and stacked, by combining the first ceramic green sheet with the second The interface between the ceramic green sheets is coated with a shrinkage-inhibiting material glue containing glass components to form a shrinkage-inhibiting pad.

[0068] The softening temperature of the glass component contained in the shrinkage inhibiting mat is lower than or equal to the shrinkage initiation temperature of the first and second ceramic green sheet...

no. 2 example

[0072] In a second example, fabrication and calcination have Figure 4 The green sheets of the structure shown were stacked to obtain a multilayer ceramic substrate. As a green sheet stack, a multilayer mother stack was produced in a similar manner to the first example.

[0073] First, in order to obtain a 100 mm square green sheet stack distributed with a plurality of cavities, a first ceramic green sheet having a plurality of openings and a second ceramic green sheet having no openings were prepared and stacked. The ceramic green sheet has a composition including a glass composition.

[0074] The shrinkage-suppressing material green sheet having the same shape as the first ceramic green sheet is made of a shrinkage-suppressing material that becomes a shrinkage-suppressing mat including a glass component. The glass component contained in the shrinkage inhibiting material is the same type as that contained in the ceramic green sheet.

[0075] The inorganic material sheet co...

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PUM

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Abstract

The present invention provides a multilayered ceramic substrate suitable to be fired, including having a first ceramic green sheets having an opening for defining a cavity, and second ceramic green sheets having no opening. The first ceramic green sheets overlaps the second ceramic green, and there is a aperture defining at the overlapping direction at least at one end surface and the aperture dedining extending to the inner peripheral surface of the second ceramic green sheets.The shrinkage-reducing pad is exposed on the entire periphery of the inner peripheral surface of the cavity . The shrinkage-reducing pad at the entire or part of the boundary interface between the first and second ceramic green sheets is exposed on the entire periphery of the inner peripheral surface of the cavity.

Description

field of invention [0001] The present invention relates to a multilayer ceramic substrate and a method of manufacturing the same. In particular, the present invention relates to a multilayer ceramic substrate having cavities in which electronic units are mounted and fixed, and a method of manufacturing the same. Background technique [0002] In recent years, the demand for small and lightweight electronic units with more functions and higher reliability has been increasing. Therefore there is a need to increase the lead density on the substrate. [0003] In response to the need to increase the wiring density of the substrate, manufacturing a multilayer ceramic substrate by stacking a plurality of ceramic green sheets printed with conductive thin films and pressing and calcining the ceramic green sheets has been developed. [0004] In order to reduce the size and thickness of the multilayer ceramic substrate, it is effective to form cavities for mounting electronic units in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B11/00H01L21/48H05K3/46
CPCY10T29/49124H01L21/481H05K3/46
Inventor 原田英幸砂原博文
Owner MURATA MFG CO LTD