Binder

Abstract

The binding clip 10 of the present invention can smoothly apply and release binding force to each binding pin by synchronously moving the moving parts, and can also facilitate the insertion of the binding pin into the pin passage. It has the following structure: the base sheet 15 has a binding passage 14 for inserting a plurality of binding pins 13 respectively; the moving part 16 is arranged on the base sheet 15 and corresponds to the positions of the pin passages 14 respectively; the operation part 17 is connected to the moving part 16 Connect and operate the moving part 16. Each moving part 16 can open and close the pin passage 14, and can apply binding force to the binding pin 13 when the pin passage 14 is blocked. Each moving member 16 is provided so as to be able to move between the positions of closing and opening each pin passage 14 when a predetermined operation is performed on the operation part 17 .

Description

technical field [0001] The present invention relates to a binding clip, and more particularly to a binding clip capable of imparting binding force by protruding the binding prongs along the position of the substrate. Background technique [0002] In the past, binders used as flat file folders, letter folders, etc. are as follows Figure 15 and 16 type shown in . The binding clip 80 includes: a substrate 81 extending in the shape of a slender plate; a pin passage 83 formed by holes provided at two places in the longitudinal direction of the substrate 81 for inserting the binding pins 82; a pair of moving parts 85, 85, The pin path 83 is slidable between opening and closing positions provided on the upper side of the base sheet 81 ; The operation part 86 has a hinge part 87 whose both ends in the longitudinal direction and the central part are thin-walled, thereby, as Figure 16 Shown is oblique buckling deformation. In the binding clip 80, when the operating portion 86 is...

AI Technical Summary

Problems solved by technology

[0003] However, in the binding clip 80, when the operating portion 86 is operated, the frictional resistance between the moving parts 85, 85 and the substrate 81 and the binding pin 82 or the direction of the force applied to the operating portion 86 will vary with the operating process. Therefore, it is difficult to move the moving parts 85, 85, etc., and it is difficult to maintain the relative position symmetry of the pin passages 83, 83 and the moving parts 85, 85.

In this way, it is difficult to apply and release the binding force on each binding pin at the same time, and the operation of the operation portion 86 may be inappropriate.

In addition, the moving parts 85, 85 and the operation part 86 are often molded by resin material. Therefore, after the substrate 81 is taken out from the binding pin 83, due to the elastic force of the hinge part 87, the moving parts 85 are separated from each other. Blocking the pin passage 83, the moving part 85 will hinder the smooth progress of the operation of inserting the binding pin 82 in the pin passage 83, which will lead to inappropriate situations.

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