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Chip type electronic part

An electronic component and chip-type technology, applied to varistors, multilayer capacitors, resistors with a positive temperature coefficient, etc., can solve the problem of low efficiency in the terminal electrode installation process

Inactive Publication Date: 2003-03-26
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, conventionally, there was a problem that the mounting process of terminal electrodes was inefficient.

Method used

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  • Chip type electronic part
  • Chip type electronic part
  • Chip type electronic part

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] refer to figure 1 , which shows chip-type electronic components such as capacitor chips. The illustrated chip-type electronic component includes a ceramic base 1 , a plurality of internal electrodes 10A, 10B, and a pair of terminal electrodes 2 , 3 .

[0044] Such as figure 2 As shown, the ceramic substrate 1 is formed as a square cuboid with equal width and thickness at both end faces in the longitudinal direction. In the illustrated real-time mode, the ceramic substrate 1 is a ceramic dielectric body.

[0045] Internal electrodes 10A, 10B, in order to obtain larger electrostatic capacity, such as image 3As shown, the main body portion 101 thereof is formed with a wider width W1, and the lead-out portion 102 derived from the main body portion 101 is formed with a width W2 narrower than the width W1. The two edges of the lead-out portion 102 in the width direction are located at a distance L relative to the two sides of the ceramic substrate 1 in the width direct...

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PUM

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Abstract

The invention is a chip-type electronic component, while forming the terminal pole, it is easy to adjust the direction of ceramic base. The both ends of ceramic base 1 in length direction is square. The internal pole 10A, 10B in thickness direction of ceramic base 1, through the ceramic layer 11A, 11B of ceramic base reciprocally, is embedded in internal of ceramic base 1. The lead out portion 102 of internal pole 10A, 10B at both ends in width direction, relative to the both ends in width direction of ceramic base 1 exist an interval distance and locate on inside, and expose from the range of one end terminal in length direction. The terminal pole 2, 3 is located on the end terminal of ceramic base 1, and connection with one end terminal of lead out portion 102, and relative to another 4 sides adjacent to the end terminal, the relative 2 side exist a fixed distance.

Description

technical field [0001] The present invention relates to a chip-type electronic component represented by a capacitor chip, and specifically relates to an improvement of the electronic component. Background technique [0002] Capacitor chips, which are a representative example of chip-type electronic components, have wide internal electrodes to obtain larger capacitance, and a large number of laminations can be achieved by forming thin-film dielectric layers. [0003] Such as Figure 11 As shown, in the capacitor chip in the past, inside the ceramic substrate 1, the wide internal electrodes 10A, 10B having the same width from the main body 101 to the lead-out part 102 are separated into layers by the ceramic substrate in the thickness direction of the ceramic substrate, and The lead-out portions 102 of the internal electrodes 10A and 10B are embedded therein, and are exposed from both end surfaces of the ceramic base 1 . Two opposite ends of the ceramic base 1 are provided wi...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01C7/02H01C7/10
Inventor 安彦泰介佐藤博树
Owner TDK CORPARATION