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Method for uniformly distributing pressure

A technology of uniform distribution and pressing force, applied in the direction of clamping/spring connection, etc., which can solve the problem of adding materials

Inactive Publication Date: 2003-04-23
LITE ON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All the improvement methods mentioned above are only palliative methods. The wrong application of the theory of material mechanics at the beginning will naturally lead to serious consequences. However, the improvement methods mentioned above can not solve the problem fundamentally, but instead increase the cost of materials and processing, and the problem is still potential.
[0008] As can be seen from the above, the above-mentioned known crimping contact technology obviously has some shortcomings in actual use, and it is urgent to be improved.

Method used

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  • Method for uniformly distributing pressure
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  • Method for uniformly distributing pressure

Examples

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Embodiment Construction

[0024] see Figure 4A As shown in C, the present invention provides a method for evenly distributing the pressing force, any device that overlaps the flexible circuit sheet with the rigid circuit sheet (or flexible circuit sheet), and then applies pressure to make the two conductive , it overlaps a first circuit chip 10 on a second circuit chip 20, the first circuit chip 10 is a flexible circuit chip, the second circuit chip 20 is a hard circuit chip or a flexible circuit chip, and the first circuit chip 10 is a flexible circuit chip. The first circuit chip 10 and the second circuit chip 20 are provided with corresponding first contacts 11 and second contacts 21 respectively, and the first circuit chip 10 is overlapped with the second contacts of the second circuit chip 20 by the first contacts 11 21. Place an elastic body 30 above the contact points 11 and 21 for applying pressure, then use an upper cover 40 and a lower cover 50 to press the elastic body 30, and finally use s...

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Abstract

The method for uniformly distributing pressure is characterized by that an elastic body is used for applying pressure to the connected point of overlapped first circuit wafer (soft circuit wafer) andsecond circuit wafer (hard or soft circuit wafer) and making them conduct, then a fixing point (for example screw, etc.) is mounted on a proper position on the elastic body, so that the pressure can be uniformly distributed on the first and second circuit wafers.

Description

technical field [0001] The invention relates to a method for evenly distributing the pressing force, especially to a method for evenly distributing the pressing force on the pressing contact, where the flexible circuit chip is lapped on the hard or flexible circuit chip, and then the pressure is applied to make the The method can be applied to both devices that conduct. Background technique [0002] Currently known crimping contacts are shown in Figures 1A to C, a flexible circuit board (mebrane) 10a is lapped on a rigid circuit board (PCB) 20a, and an elastic body (foam) 30a is placed above the contact As the purpose of applying pressure, then use an upper case 40a and a lower case 50a to press it down, and finally use a screw 60a to lock the upper case 40a and the lower case 50a, so that the screw 60a It is fixed to both ends of the elastic body 30a, and the screw 60a is used as a fixing point. [0003] The above method has a serious disadvantage, that is, the upper and ...

Claims

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Application Information

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IPC IPC(8): H01R4/46
Inventor 林文宽
Owner LITE ON TECH CORP