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Drum fixture and drum treating unit and drum treating method using the same fixture

A processing unit and reel technology, applied in thin material processing, electrical components, transportation and packaging, etc., can solve the problems of difficult connection and separation of reels, pollution, damage to welding wire, etc.

Inactive Publication Date: 2003-06-04
W C HERAEUS GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the wire will be contaminated and damaged
[0016] Also, when the reel clamp is longer than the sum of the lengths of the reel and the handle, the reel cannot be fully fitted in the reel clamp, so that connection and detachment of the reel by the base is not easily performed
When the spool clamp has a clamp handle at its end, the clamp handle is internally caught by the handle of the base, so that the base cannot be used to connect and detach the spool, while limiting the capacity of the spool magazine. Available range

Method used

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  • Drum fixture and drum treating unit and drum treating method using the same fixture
  • Drum fixture and drum treating unit and drum treating method using the same fixture
  • Drum fixture and drum treating unit and drum treating method using the same fixture

Examples

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Embodiment Construction

[0036] Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0037] figure 1 is a perspective view of a roll clamp according to a preferred embodiment of the present invention; and figure 2 is the reel clip along the figure 1 Cross-sectional view of line A-A in. Figure 5 is an enlarged perspective view of the roll handling unit with the roll clamp.

[0038] The spool 10 is wound with welding wire as is known in the art. As shown, the spool 10 is formed of a cylindrical portion (not shown) on which the welding wire W is wound, and a pair of small-diameter flanges 12 at both ends of the cylindrical portion. A groove 14 is formed on the small-diameter flange 12 on one side to hold the end of the welding wire W. As shown in FIG. The tip of the welding wire W passing through the groove 14 is fixed to the outer surface of the flange 12 by an adhesive tape 16 .

[0039]The roll clamp 20 is connected to a flange 1...

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PUM

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Abstract

A spool gripper (20) is coupled to any one of flanges (12) provided at both sides of a spool (10) wound with a semiconductor device bonding wire thereon. The spool gripper has an inner diameter portion (22) for receiving a spool holder when the spool is fitted to the spool holder, a coupling portion (24) coupled to the circumference of the flange (12) while bearing a diameter larger than the inner diameter portion (22), and an outer diameter portion (26) with a diameter larger than the coupling portion (24). The worker grips the outer diameter portion (26) to handle the spool (10). The handling of the spool can be made without directly touching the spool. The wire bonding operation is made while the gripper being coupled to the flange. Therefore, it is not needed that the gripper (20) should be decoupled from the flange (12) to make the wire bonding operation. Accordingly, the durability of the gripper and the reliability in the spool holding can be maintained without deterioration while preventing separation of the spool from the gripper. Irrespective of the length of the spool holder or the presence of the spool fixation member, the spool handling unit can be used with any typed spool holder.

Description

technical field [0001] The present invention relates to a soldering wire assembly for processing semiconductor chip packages, in particular to a reel clamp detachably mounted on the flange of the reel; the invention also relates to a method of handling a reel using the reel clamp , this method can effectively prevent the welding wire from being polluted and damaged due to the carelessness of the staff. Background technique [0002] In general, a bonding wire assembly is a device for electrically connecting a lead wire of a lead frame to a bonding pad of a semiconductor chip having electrical characteristics through a conductive wire such as a high-purity platinum (Pt) wire or aluminum Silk. [0003] A wire assembly typically has a spool, spool clamp, wire supply guide, wire clamp, and capillary. The conductive filament is wound on a spool, and the spool is mounted on a spool clamp. The conductive filament is melted by a capillary and a welding torch, and soldered to the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B65H49/38B65H67/06B65H75/14H01L21/52
CPCB65H2701/361H01L2224/45124H01L2924/01082B65H49/38H01L2924/01004B65H67/065H01L24/78H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01074H01L2924/01078H01L2924/01013H01L2224/786B65H75/141B65H2402/414H01L2224/851H01L2924/00014H01L2224/45015H01L24/45H01L2224/48H01L2924/00015H01L2924/00H01L21/52
Inventor 白丁宇
Owner W C HERAEUS GMBH