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Surface checking method and surface checker

A surface inspection device and surface inspection technology are applied in the direction of measuring devices, optical devices, instruments, etc., which can solve the problems of the influence of the amount of detection light and the inability to obtain detection accuracy, etc.

Inactive Publication Date: 2003-10-08
KK TOPCON +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, it is known that scattered reflected light caused by foreign objects will also affect the amount of detected light due to the rotational position of the polarizer.
For this reason, there is currently a problem that it is not possible to obtain sufficient detection accuracy for surface inspection of foreign matter only by rotating the polarizer so that the scattered reflected light on the surface of the substrate becomes the minimum.

Method used

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  • Surface checking method and surface checker
  • Surface checking method and surface checker
  • Surface checking method and surface checker

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Embodiment Construction

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0021] figure 1 Shows the basic configuration of surface inspection equipment.

[0022] In the figure, 1 is the substrate scanning mechanism part, and this scanning mechanism part 1 comprises the wafer chuck 3 that clamps substrate (silicon wafer) 2 and the rotary motor 4 that rotates this silicon wafer chuck 3, and this rotary motor 4 is set On the sliding stage 20 moving in the horizontal direction (refer to figure 2 ), the slide stage 20 is driven by a slide motor 21 (refer to figure 2 ) to move in the horizontal direction.

[0023] In addition, in the figure, 6 is a laser light emitting part, 7 is a light projection optical system, and 8 is a light receiving part. The laser light emitted from the laser light emitting unit 6 is irradiated onto the surface of the silicon wafer 2 by the projecting optical system 7 .

[0024] and, figure 1 An example of the proj...

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PUM

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Abstract

A surface inspection method, comprising: in a surface inspection device having a light receiving unit and a light receiving polarization angle changing member, changing the receiving light polarization angle by using the above light receiving polarization angle changing member, and accepting scattered reflection from the surface of a substrate coated with standard particles The light step, and the step of setting the polarization angle of the received light in the state where the S / N ratio of the received light output becomes maximum, and performing a surface inspection.

Description

technical field [0001] This application claims the benefit of priority based on prior Japanese Patent Application No. 2002-88555 (filed on March 27, 2002), the entire contents of which are hereby incorporated by reference in this application. [0002] The invention relates to a surface inspection method and a surface inspection device for detecting foreign matter on the surface of a substrate such as a silicon wafer. Background technique [0003] When manufacturing semiconductor devices, fine foreign matter adhering to the surface of substrates such as silicon wafers has a great influence on product quality. For this reason, surface inspection of the substrate surface is carried out in the manufacturing process of the semiconductor element. In addition, the integration level of semiconductor elements is constantly increasing, and the manufacturing process is becoming more and more complicated. Various films must be formed on the surface of the silicon wafer. [0004] The s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/30G01N21/21G01N21/88G01N21/94G01N21/956H01L21/66
CPCG01N21/21G01N21/94
Inventor 矶崎久山崎伦启吉川浩神酒直人前川博之高桥直弘
Owner KK TOPCON