Cooling device with fan equiped at side surface

Abstract

A side flow cooling device. It includes a fin stack (20) with arms (19) extending therefrom, and a mounting surface (13) for connecting the fin stack (20) to the component (50) to be cooled. The fin stack (20) and arms (19) include a plurality of fins (30) extending outwardly therefrom and aligned with a vertical axis (V) of the fin stack (20). The fins (30) have cooling surfaces (30s) and slits (S) between adjacent fins (30) aligned with the longitudinal axis (L) of the fin stack (20). Fans (70) or the like may be connected to the sides (2, 4) of the cooling device (10) to generate an air flow (F) substantially along the longitudinal axis (L). The airflow (F) passes through the cooling surface (30s) of the fins (30), moistening the exposed portions of the fin stack (20) and the exposed portions (19a, 19b) of the arms (19) to remove moisture from the fins. The stack (20) dissipates heat. The heat sink stack (20) is not covered by the fan (70), so the fins (30) can occupy a major portion of the surface area of ​​the heat sink stack (20), thereby increasing the available surface area for cooling.

Description

Technical field [0001] The present invention generally relates to a side flow cooling device for removing heat from components connected to the side flow cooling device. The present invention particularly relates to a lateral flow cooling device including a stack of fins and a plurality of vertically oriented fins around the stack of fins. The heat is radiated vertically from the fin stack to the fins. The cooling surfaces of the fins and the slits between the fins are arranged along the longitudinal axis of the fin stack, so that the airflow source positioned on the side of the lateral flow cooling device generates airflow for dissipating heat from the fins. Background technique [0002] In electronic technology, it is known to place a heat sink in contact with an electronic device, so that waste heat generated by the operation of the electronic device is transferred to the heat sink, thereby cooling the electronic device. With the development of electronic devices with high clo...

AI Technical Summary

Problems solved by technology

[0006] There are downsides to increasing the size of the fan and heatsink

First, if the size of the heatsink increases vertically (i.e., in a direction transverse to the PC board), then the heatsink will be taller and will not fit in the vertical space of the system carrying the heatsink, For example in a desktop computer case

[0007] Second, if the PC board has a vertical orientation, then a heavy and tall heat sink can create mechanical stress on the PC board and / or electronics, leading to failure of the device or PC board

[0009] Fourth, when the heat sink has a cylindrical shape formed by fins, it is generally not possible to mount a plurality of such heat sinks close to each other, because air entering and exiting the fins is blocked by adjacent heat sinks, resulting in reduced cooling efficiency

In each case, the fan fails

[0015] Finally, glue is usually used to mount the fan on the heatsink, and the glue can get into the fan, causing it to fail

Any of the above fan failure modes can lead to the failure of the electronic device cooled by this heat sink, because the air circulation generated by the fan is very important to effectively dissipate the waste heat generated by the electronic device

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