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Improved semi-automatic pick and place machine for assembly of components

A semi-automatic and component technology, applied in the direction of electrical components, electrical components, micro-control devices, etc.

Inactive Publication Date: 2004-01-07
COUNCIL OF SCI & IND RES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The operator must manually move the pickup head assembly on the X, Y slide rails

Method used

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Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0114] Summary of Inventions

[0115] The present invention provides an improved semi-automatic pick and place machine for SMD and fine pitch components by using a software using an object oriented approach to control the machine and making it more user friendly.

[0116] Detailed description of the invention

[0117] Accordingly, the present invention provides an improved semi-automatic pick and place (SAPP) machine for assembling small pitch and standard surface mount device (SMD) components on printed circuit boards, said machine comprising a high precision X, Y stage Segment sub-components, a guide block sub-component, X, Y brake components, an object-oriented user interface software component installed in a computer system, a microcontroller sub-component for controlling said machine, embedded in said machine Machine software in the component's EPROM.

[0118] The microcontroller software is embedded in EPROM in one embodiment of the invention, in this embodiment the el...

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PUM

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Abstract

An improved semi-automatic Pick Place (SAPP) Machine for assembly of Fine Pitch and Standard Surface Mount Device (SMD) components on Printed Circuit Boards, said machine comprising a high precision X, Y stage sub-assembly, a guide block sub-assembly, X Y brake assembly, an object oriented user interface software components installed in the computer system, a machine software for the control of said machine embedded in the EPROM of microcontroller subassembly.

Description

technical field [0001] The invention relates to an improved semi-automatic pick-and-place machine for Surface Mount Devices and small-pitch components. Background technique [0002] A pick-and-place machine for Surface Mount Devices (SMD) is an electromechanical system that is widely used in the PCB component assembly stage in the electronics industry. These computer-controlled machines not only help operators automatically pick up the correct SMD components, but also place these components on printed circuit boards (Printed Circuit Boards, PCB) very precisely. The application of these machines provides more economical PCB products. [0003] The traditional lead-in electronic components are mounted and soldered on the back of the PCB through holes. Because the traditional lead-in components are installed through the holes of the PCB, they are called through-hole components. On the contrary, surface mount devices (SMD) are electronic integrated circuits and components that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F9/22G06F9/44H05K13/04
CPCH05K13/046
Inventor 维亚卡拉纳姆·莫哈纳·拉克希米·纳拉辛哈姆兰迪尔·巴特纳格尔比平·德夫·夏尔马什拉瓦纳·库马尔·拉马拉奥·拉亚贡德安莫尔·库马尔·梅迪拉塔
Owner COUNCIL OF SCI & IND RES