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Vinyl compound and its cured products

A technology of vinyl compounds and compositions, applied in the field of cured products and curable resin compositions, can solve the problems of not fully satisfying physical properties and the like

Inactive Publication Date: 2004-03-10
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

So far, there are no physical properties that fully meet these requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Synthesis of Bifunctional PPE Oligomer Compounds

[0035] Into a longitudinally long reactor having a volume of 2 liters and equipped with a stirrer, a thermometer, an air introduction tube and baffles, 1.3 g (0.012 mol) of CuCl, 70.7 g (0.55 mol) of di-n-butylamine and 400 g of methyl ethyl ketone were charged. The components were stirred at a reaction temperature of 40°C. In 120 minutes, 43.2 g (0.16 mol) of 2,2',3,3',5,5'-hexamethyl-[1,1'-biphenyl]-4,4' as divalent phenol A solution of diol and 58.6 g (0.48 mol) of 2,6-dimethylphenol in 800 g of methyl ethyl ketone was added dropwise to the reactor while bubbling with 2 L / min of air. After the addition was complete, stirring was carried out for 60 minutes while continuing to sparge with 2 L / min of air. An aqueous solution of sodium dihydrogen edetate was added to the stirred mixture to terminate the reaction. Then, washing was performed with 1N aqueous hydrochloric acid solution and then with pure water. The solu...

Embodiment 2

[0039] 10 g of the vinyl compound resin obtained in Example 1 was melted, degassed and molded at 150° C. and then thermally cured at 200° C. for 6 hours to obtain a cured product.

Embodiment 3

[0041] 6 g of the vinyl compound resin obtained in Example 1 and 0.6 g of IRGACURE819 (supplied by Ciba Specialty Chemicals, photopolymerization initiator) were dissolved in 4 g of carbitol acetate to obtain a resin composition. The resin composition was applied onto the surface of the copper-clad laminate using a screen printer, and then dried at 80° C. for 30 minutes using an air dryer. Then the pattern film is placed thereon and using UV radiation equipment (provided by EYE GRAPHICS Co., Ltd.: UB0151, light source: metal halide lamp), at 2,000mJ / cm 2 The surface of the copper-clad laminate is exposed. After exposure, development was performed using methyl ethyl ketone. In this case, only the non-exposed portion was dissolved in methyl ethyl ketone to obtain a developed pattern of the cured product of the resin. The pencil mar strength (JIS K5400) of the resin cured product was H.

[0042] Measurement methods

[0043] Cured product properties of the vinyl compound obtain...

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PUM

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Abstract

There are provided a vinyl compound which is excellent in heat resistance and electric characteristics and excellent in reactivity by introducing a vinyl group into a terminal of a bifunctional polyphenyleneether oligomer, and a cured product thereof which has a high glass transition temperature, has a low dielectric constant and a low dielectric loss tangent and has the excellent properties of polyphenylene ether.

Description

technical field [0001] The present invention relates to novel vinyl compounds, curable resin compositions comprising the above compounds and cured products of these substances. More particularly, according to the vinyl compound of the present invention, by polymerizing the vinyl compound or copolymerizing the vinyl compound and various unsaturated compounds, a polymer material excellent in heat resistance and dielectric characteristics can be provided. [0002] In addition, it can be used as a material excellent in heat and electricity, and can be cured by heat or light for a wide range of uses such as resins for photoresists, sealing resins for liquid crystal displays, resins for liquid crystal color filters, UV coating compositions, various coating agents, adhesives, build-up laminates, etc. Background technique [0003] In general, vinyl compounds are widely used as raw materials for various functional polymer materials such as photosensitive materials, optical materials...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F12/00C08F290/06C08F299/02C08G65/48C08K5/06C08L71/12
CPCC08F299/022C08G65/485C08K5/06C08L71/126C08F290/062C08F12/00
Inventor 石井贤治则末泰正大野大典宫本真
Owner MITSUBISHI GAS CHEM CO INC
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