Integrated circuit packaging body
A technology for integrated circuits and packages, applied in the field of integrated circuit packages, can solve problems such as the inability to effectively reduce the size, the length of the gold wire, and the reduction in the proper rate of wire bonding.
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[0032] see Figure 5 As shown in FIG. 8, the structure of the integrated circuit package 1 provided by the first preferred embodiment of the present invention mainly includes a substrate 10 and a circuit layout 20, which are composed of a plurality of copper wires 21, which can be arranged on one or both sides of the substrate 10 . A solder resist layer 30 is disposed on the substrate 10 to cover a predetermined portion of the circuit layout 20 and a plurality of conductors 40 .
[0033] For making the integrated circuit package 1 of the present invention, please refer to Figure 5 As shown, firstly, the substrate 10 is prefabricated with the circuit layout 20 and the solder resist layer 30 thereon. The circuit layout 20 defines a plurality of connecting portions 22 .
[0034] Next, if Image 6 As shown, using the existing photo-chemical method (photo-chemical method), the part of the solder resist layer 30 above the conductive part 22 corresponding to the circuit layout 2...
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Abstract
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