Exposure method for exposure device

Abstract

An exposure method for an exposure device has a good integrated accuracy of a substrate and a photomask and a short process time in performing exposure to a substrate rapidly. The invented method uses a substrate integrated with an integration mark and a patterned photomask having a photomask mark, and performs exposure in a state where the photomask is tightly connected to the substrate. The invented method comprises: using the photomask mark as a basis to obtain a point MA where the diagonal lines of half region of the photomask intersect, and a point MB where the diagonal lines of the whole region of the photomask intersect; using the integration mark as a basis to obtain a point WA where the diagonal lines of half of the region of the substrate intersect, and a point WB where the diagonal lines of the whole region of the substrate intersect; performing a comparison process of comparing the MB point of the photomask mark with the WB point of the integration mark; performing a determination process of determining whether the WB point of the integration mark relative to the MB point of the photomask mark is within a tolerance range; and irradiating the exposure light on the whole substrate when the determined result from the determination process falls within the tolerance range.

Description

technical field [0001] The invention relates to an exposure method of substrates such as printed circuit boards and liquid crystal substrates and masks, in particular to an exposure method of an exposure device that performs exposure operations according to distribution points (points) between masks and substrates. Background technique [0002] Patent Document 1: Japanese Unexamined Patent Publication No. 11-194507 (paragraphs 0011-0014, image 3 ) [0003] Patent Document 2: Japanese Unexamined Patent Publication No. 2000-122303 (full text) [0004] Conventionally, when producing a printed circuit board, an exposure device is used which aligns a mask provided with a circuit pattern with a substrate, and then irradiates exposure light in a state in which the two are in close contact, so that the pattern of the circuit is aligned. copied to the substrate. [0005] Such an exposure apparatus has: a base on which a substrate is placed; a mask having a predetermined pattern an...

AI Technical Summary

Problems solved by technology

[0008] However, in the technique described in Patent Document 1, the alignment of the entire substrate is performed first, alignment is performed on any divided area in an appropriate order, and exposure is performed from the area where the alignment has been completed. Therefore, after dividing into four areas, In the case of , the calibration of the entire substrate requires five calibration steps, and even in the case of dividing into two areas, it is necessary to perform three calibration steps, which is time-consuming

[0009] Moreover, since the entire substrate is calibrated first by using the mask and the marks on the substrate, the error becomes larger after the calibration is performed on each area.

[0010] Since the technology described in Patent Document 2 is a method of measuring the center of gravity position of each pattern to be exposed and the center of gravity position of the whole, based on the measured data, correcting the reference position information of each of the plurality of regions, and based on the corrected data, , to expose each pattern, therefore, the exposure of each pattern takes time, and it is difficult to apply it to a device such as an exposure device for a printed circuit board that directly exposes the pattern of the mask by making the mask and the substrate close middle

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