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Adhesive wafers for die attach application
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A wafer, adhesive technology used in the manufacture of chip scale and stacked die packages
Inactive Publication Date: 2005-02-02
NAT STARCH & CHEM INVESTMENT HLDG CORP
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This method requires specialized film lamination equipment as well as dedicated film die bonding equipment
Method used
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example 1
[0022] Example 1: A thin film thermoset epoxy adhesive (RP571-10 from Ablestik Laboratories), supplied as a 12 inch x 12 inch x 2 mil thick sheet, was laminated to a BT laminate (Mitsubishi Consortium Gas Chemical Co., 8 inches by 8 inches by 8 mil thickness) on both sides:
Speed: 30.5 cm / min
Temperature: 135°F
Pressure: 40psi
[0023] The laminating adhesive was then mounted on cutting tape (Nitto SPV224) and cut into 4mm x 6mm decals using a Disco DAD320 cutter set to the following parameters:
[0024] The ability of the diced adhesive to be handled was tested with an ESEC Die Bonder 2007 LOC die bonder with pick-and-place capability, with two tests set to the following parameters:
[0026] Example 2: Single ply polyethylene (US Plastics 30.48 cm x 30.48 cm x 3 mil thickness) mounted on a Nitto SPV-224 cutting belt and using a Disco DAD 320 cutter with NBC-ZH 27HEEE blade, 30,000 rpm spindle Rotational speed and feed rate of 2.54 cm / sec were cut into 4 mm x 6 mm dimensions. The cutting conditions are:
[0027]The ability of the diced adhesive to be handled was tested with a pick-and-place ESEC Die Bonder 2007 LOC die bonder set to the following parameters:
[0028] Example 3: The same test as Example 2 was performed except that the backing material was 5 mil silicone. Failed to pick up ten times out of ten tests.
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Abstract
Fabrication of a CSP or a stacked chip CSP can be accomplished with an unsupported film adhesive or an adhesive supported on a rigid carrier, using standard die attach equipment constructed for use with a paste adhesive.
Description
technical field [0001] The present invention relates to adhesives and bonding methods used in the manufacture of semiconductor packages. The invention is particularly useful for manufacturing chip scale and stacked die packages. Background technique [0002] Chip scale packaging (CSP) offers the advantages of light weight, small footprint, high density, and improved electrical performance in a semiconductorpackage. CSPs comprising one or more integrated semiconductor chips stacked in sequence further improve electrical performance and reduce space and weight. [0003] The semiconductor is mechanically and electrically connected to the substrate, which in turn is connected to other devices or an external power source. The substrate can be rigid like a metallead frame, ceramic or laminate, or it can be flexible like polyimide tape. [0004] A well-known method of connecting a semiconductor to its substrate is wire bonding, in which the semiconductor chip is first adhered ...
Claims
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Application Information
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