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Packaging structure of light sensing ship and its method

A technology of packaging structure and packaging method, which can be applied to electrical components, electric solid-state devices, circuits, etc., and can solve problems such as affecting the optical sensing effect and increasing the cost of the process.

Active Publication Date: 2005-05-25
HARVATEK CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The existing process is to first form a plurality of light sensing chips on the wafer, and then perform cutting, gluing, wire bonding and other processes to package the light sensing chips, so the light sensing chips are in the packaging process , it is easy to affect the light-sensing effect due to particles sticking to the photosensitive area of ​​the chip, so that the cleanliness requirements of the process environment must be improved, so the process cost will be increased

Method used

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  • Packaging structure of light sensing ship and its method
  • Packaging structure of light sensing ship and its method
  • Packaging structure of light sensing ship and its method

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Embodiment Construction

[0040] see figure 2 As shown, the present invention is a package structure of a photo-sensing chip, which includes a substrate 10, a photo-sensing chip 20, a support portion 30, a transparent plate 40 and a wire 50, wherein the photo-sensing chip 20 has a photo-sensing area 21 and welding pads 22 are arranged on its upper surface and the welding pads 22 are arranged around the light sensing region 21, and the light sensing chip 20 is arranged on the substrate 10, which can be a printed circuit board, The supporting portion 30 is set around the outer peripheral edge of the light sensing area 21 on the light sensing chip 20, and the transparent plate 40, such as a glass plate or a transparent resin plate, is fixed on the supporting portion 30 to correspond to the light sensing area. Measuring area 21, wherein a space 23 is formed between the transparent plate 40, the support portion 30 and the light sensing area 21 of the light sensing chip 20, and then the wire 50 is electrica...

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PUM

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Abstract

A photo sensitive chip package structure and method, which contains substrate, photo sensitive chip, support, transparent board, line and protector wherein the support is around set on photo sensitive chip, the transparent board is covered on support for corresponding the photo sensing area on chip and setting chip on substrate to connect chip with substrate by line, the protector is adhered on circumference of chip and substrate for protecting line to form the said small size package structure.

Description

technical field [0001] The invention relates to a packaging structure of a light sensing chip and a method thereof, in particular to packaging the light sensing chip by using a packaging method of the light sensing chip. Background technique [0002] The existing light sensing chip packaging structure such as figure 1 As shown, a plurality of light-sensing chips (not shown) are manufactured on a wafer first, and are separated into individual light-sensing chips 10a in a dicing process, and then a printed circuit board substrate 20a is provided to carry the light-sensing chips 10a, and stick the support portion 30a on the printed circuit board substrate 20a to form a concave portion 21a, and then use the bonding agent to stick the photo-sensing chip 10a in the concave portion 21a of the substrate 20a, and heat it to cure, and then Wire bonding is performed, and then bonding agent is dispensed on the supporting portion 30a, and then a glass upper cover 40a is sealed thereon. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/14
Inventor 汪秉龙张正和黄裕仁谢朝炎
Owner HARVATEK CORPORATION
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