Dehydration drying method and apparatus, and substrate processing apparatus

Abstract

The dehydration drying method dehydrates and dries the substrate. The substrate (15) is dehydrated and dried without rotation while the substrate (15) is housed in a carrier (10) for carrying the substrate (15) between devices for performing some processing.

Description

technical field [0001] The present invention relates to a dehydration drying method, a dehydration drying apparatus, and a substrate processing apparatus for dehydrating and drying substrates processed in wet processing used in semiconductor manufacturing processes and the like. Background technique [0002] So far, in semiconductor manufacturing, it has been used to spin-dry or N 2 Airflow treatment to dehydrate and dry substrates treated in wet treatment in which the substrate is rotated at high speed by a spin dryer to remove moisture attached to the surface of the substrate by centrifugal force. 2 Gas is blown onto the substrate to dry the substrate. [0003] In recent years, as the processing speed of semiconductor devices has become higher, so-called low-k thin films have been used as insulating films to be formed on substrates. Due to their production process, many of these low-k films have a porous structure as well as hydrophilic and water-absorbing properties. I...

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Problems solved by technology

[0004] The problem with such water molecules remaining in the low-k film is that the remaining water molecules make the low-k film swell and thus deform

In addition, when the subsequent processing of the substrate is performed under high vacuum or ultra-vacuum, the degree of vacuum required in the subsequent processing cannot be achieved due to water molecules remaining in the low-k thin film

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