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Method for replacing and resetting imperfect multi-piece printed circuit board

A printed circuit board and multi-chip technology, which is applied in the fields of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problem of bad multi-chip printed circuit board replacement reset cutting limit and error value, bad multi-chip printed circuit Problems such as board replacement and replacement can be solved to achieve the effect of strengthening market competitiveness, reducing waste disposal problems, and reducing production costs

Inactive Publication Date: 2005-07-20
赖金泉
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for replacing and resetting defective multi-connected printed circuit boards, which can overcome the problems of cutting limitations and error values ​​in the replacement and reset of defective multi-connected printed circuit boards, and then achieve its industrial application. positive effects of sex

Method used

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  • Method for replacing and resetting imperfect multi-piece printed circuit board
  • Method for replacing and resetting imperfect multi-piece printed circuit board
  • Method for replacing and resetting imperfect multi-piece printed circuit board

Examples

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Embodiment Construction

[0034]Please refer to Figures 1 to 3, the method for replacing and resetting defective multi-connected printed circuit boards of the present invention is first to cut the defective single-chip (printed circuit board) 11 in a defective multi-connected sheet (printed circuit board) 10 Remove, and then use the same method to cut out the good product single piece (printed circuit board) 21 in another bad multi-piece 20, and its cutting operation is carried out with precision cutting tools such as laser, CNC; and the removal The defective multi-unit sheet 10 of the defective single-piece 11 is left with a good product single-piece 12 and a missing portion 13, and then the removed good-quality single-piece 21 is filled into the missing portion 13 of the defective multi-unit piece 10, as shown in FIG. 3 As shown, after precise positioning by means of template positioning, optical positioning or computer positioning, etc., use printing, automatic, manual and other glue injection method...

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Abstract

The invention is a method for displacing and rearranging bad cascaded-plate printed circuit board (PCB), firstly cutting the bad single-plate PCB off a bad cascaded plate PCB and similarly cutting the good single-plate PCB off another bad cascaded PCB, where the cutting-off is carried out by precision cutters such as laser, CNC, etc; an incomplete part is formed in the bad cascaded-plate PCB whose bad single-plate PCB is cut off, and successively the cut-off good single-plate PCB is filled in the incomplete part, and by module locating, optical locating, computer locating, or other precision locating, in a mode of glue injecting, printed, automatic, manual, etc, special adhesive is injected to glue the bad cascaded-plate PCB and the good single-plate PCB together, and then processed by curing procedure, they form a bad cascaded-plate PCB with the same strength and precision as those of the original PCB; by this, its industrial utilization can be achieved and then the production cost is reduced and the problem of processing wastes is reduced as well as the market competitive power is strengthened.

Description

technical field [0001] The present invention is a method for replacing and resetting a bad multi-piece printed circuit board, especially a method of using precise positioning and adopting a corresponding cutting method in accordance with the thickness of the printed circuit board to make the bad multi-piece printed circuit board The replacement reset of is indeed feasible and has industrial utilization. Background technique [0002] According to the current manufacturing of printed circuit boards, several single-chip printed circuit boards are often arranged and combined on a substrate to form a multi-connected printed circuit board, and the defect rate of general multi-connected printed circuit board production is about 5% to 7%. , most of the manufacturers adopt the method of scrapping the defective printed circuit boards, thus causing an excessive waste of resources; there are also a small number of manufacturers that distinguish in advance the defective single-chip print...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 赖金泉
Owner 赖金泉
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