System and its method for high efficiency ozone water cleaning semiconductor wafer

Abstract

This invention relates to a system and a method for washing semiconductor wafer with high efficient ozone water. The method mainly utilizes super-pure water and gaseous phase ozone to carry out gas-liquid resolution and combination, concentration dynamic analysis and information feed-control containing the production of high density large flow liquid-phase ozone water for cleaning the solution, wafer, dynamic monitor to the density of ozone and additives in the solution and water temperature and analysis and feeding to the monitor values. The system includes a liquid-phase ozone generating unit, a storage tank or a washing tank, an additive supplied unit, a monitor unit and an automatic feed/control unit.

Description

technical field [0001] The invention relates to a system and method for cleaning semiconductor wafers with high-efficiency ozone water, and relates to the technical field of ozone cleaning of semiconductor wafers, in particular to a high-quality cleaning method using gas-phase ozone and water solvent in a mechanism. The liquid phase dissolves to form the ozone aqueous solution of the cleaning solution, and the ozone oxidizes the surface of the wafer material. In cooperation with the cleaning process, the monitoring of the concentration of the ozone water cleaning solution and the maintenance of concentration feedback control can quickly and effectively control semiconductor and optoelectronic processes. Photoresist or other organic attachments on the surface of wafers and glass substrates are oxidized and decomposed to clean the ozone cleaning method and its device. Background technique [0002] According to, the production of semiconductor wafers, every step included in the...

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Problems solved by technology

[0016] Analyzing the above-mentioned patent content related to the research on ozone water cleaning solution, most of them are controlled by improving the temperature and pressure operating range of the ozone water gas-liquid contact system and the cleaning system to achieve the purpose of increasing the concentration of ozone water and increasing the reaction rate; however, the efficiency in practical applications is still It is not ideal, because the improvement of the concentration of ozone water is limited by changing the physical conditions to approach the thermodynamic saturation concentration of ozone, and so far, the research and development of ozone crystal circle cleaning formulas has mostly focused on low concentrations (several ppm) application, this is the biggest technical bottleneck encountered in the development of ozone water technology at this stage, and it is also one of the reasons why it has not been widely used in the manufacturing process so far.

[0017] Another important reason is that these aforementioned patents are applied to the wafer cleaning process, and it is completely impossible to grasp the distribution of ozone concentration in the cleaning tank or to automatically adjust it; by the way, in the past, the ozone program was used in the wafer cleaning of the semiconductor manufacturing process, mainly With high-concentration gas-phase ozone, the ozone gas is dispersed into fine bubbles by disper

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