Board-level EMI shield with enhanced thermal dissipation

A board-level, substrate technology, applied in the field of board-level electromagnetic interference shielding, can solve problems such as increasing weight, not allowing mutual shielding, and consuming valuable PCB space
CN1659942AInactive Publication Date: 2005-08-24WL GORE & ASSOC INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
WL GORE & ASSOC INC
Publication Date
2005-08-24
Estimated Expiration
Not applicable · inactive patent

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Abstract

A substrate having at least one electrical component disposed thereon; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer; a plurality of apertures formed in the board-level EMI shield such that the apertures correspond to the pattern of the electrically conductive fastening units; with at least one thermally conductive interface (TCI) material disposed over the at least one electrical component; and wherein the electrically conductive layer of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit.
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Description

field of invention

[0001] The present invention generally relates to improved board-level electromagnetic interference (EMI) shielding for use in applications where heat dissipation is important. In particular, the present invention relates to a shield that is easy to disassemble, compatible with single or multi-compartment shield designs, has thinner sides, is lighter in weight and supports improved heat dissipation of the shield elements. This solution is particularly advantageous for use in smaller electronic devices, such as mobile phones, personal digital assistants, handheld and laptop computers, and the like. Background of the invention

[0002] EMI shielding limits electromagnetic radiation from entering or leaving the area of ​​a printed circuit board (PCB) that contains electronic components. An EMI shield is further defined as "board level" if it is attached directly to the PCB surface with no external or free fixtures such as screws or bolts, thereby removing a ...

Claims

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