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Sputtering apparatus capable of changing distance between substrate and deposition preventing plate used for film formation

A kind of equipment and anti-plating technology, which is applied in the field of spray plating equipment for changing the distance between the substrate and the anti-plating sheet, and can solve problems such as not being improved.

Inactive Publication Date: 2005-09-07
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the problem of unnecessary film plating on the substrate holder or in the vacuum vessel has not been improved.

Method used

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  • Sputtering apparatus capable of changing distance between substrate and deposition preventing plate used for film formation
  • Sputtering apparatus capable of changing distance between substrate and deposition preventing plate used for film formation
  • Sputtering apparatus capable of changing distance between substrate and deposition preventing plate used for film formation

Examples

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Effect test

no. 1 example

[0026] Hereinafter, the first embodiment of the sputtering equipment of the present invention will be described with reference to the accompanying drawings.

[0027] like figure 1 , 2 As shown, the spraying equipment includes a charging chamber 1, a heating chamber 3 connected to the charging chamber 1 through an openable and closable gate valve 2a, a film forming chamber 4 connected to the heating chamber 3 through an openable and closable gate valve 2b, and a film forming chamber 4 connected to the heating chamber 3 through an openable and closable gate valve 2b. The opening and closing gate valve 2c is connected to the cooling chamber 5 of the film forming chamber 4, and the unloading chamber 6 is connected to the cooling chamber 5 through the openable and closing gate valve 2d. Openable and closable gate valves 2e and 2f are provided at the inlet of the loading chamber 1 and the outlet of the unloading chamber 6, respectively.

[0028] like figure 1 , 2 As shown, the f...

no. 2 example

[0057] 5 and 6 are plan views of the main body, showing the internal structure of the film forming chamber 4 in the second embodiment of the sputtering device. Since the parts not shown in Figures 5 and 6 have the same figure 1 , 2 The structure shown in the first embodiment of the sputtering device is the same, so no specific repeated description will be given.

[0058] In the second embodiment, the film-forming chamber 4 of the sputtering equipment includes a plating protection sheet 23 with a plating protection sheet fixed part 23a and a plating protection sheet movable part 23b, a cooling water hole with positioning pins 11 and cooling water circulation The driving force transmission body 24 of 27, the mechanism 25 that introduces the driving force into the vacuum container, the driving force generating device 26 and the cooling water supply mechanism 28 that transmit the driving force to the film forming chamber (vacuum chamber) 4 through the mechanism 25.

[0059] The ...

no. 3 example

[0069] As a third embodiment, FIGS. 7 and 8 show an example of another structure of the anti-plating sheet 23 and its driving mechanism shown in FIGS. 5 and 6 . FIG. 7 shows the state of the film forming chamber 4 during film formation, and FIG. 8 is a plan view of the main body portion showing the inside of the film forming chamber 4 when the substrate is conveyed.

[0070] The plating resist 33 shown in FIGS. 7 and 8 has a positional relationship between the plating resist fixing portion 33a and the plating resist movable portion 33b opposite to that of the plating resist 23 shown in FIGS. 5 and 6 . Even with this structure, the sputtered film can be prevented from sticking to the portion of the substrate 7 where no film is to be formed and the substrate holder 8, and contact between the substrate 7 and the plating resist 33 can be prevented during conveyance.

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Abstract

A sputtering apparatus for forming a sputtered film on a substrate held on a substrate holder in a vacuum chamber includes a target, a deposition preventing plate provided between the target and the substrate holder, a substrate holder carrying mechanism, and a moving mechanism for moving the substrate holder carrying mechanism to change a distance between the substrate and the deposition preventing plate.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 200410043527.9. technical field [0002] The present invention relates to sputtering equipment, more particularly, relate to the sputtering equipment that can change the distance between substrate and anti-plating sheet for forming thin film on liquid crystal display device, semiconductor, magneto-optical recording disc, magnetic recording disc, etc. . Background technique [0003] Sputtering equipment is generally used to manufacture liquid crystal display devices, semiconductors, magneto-optical recording discs, magnetic recording discs, etc. The sputtering apparatus used for mass production includes two kinds of apparatuses, namely, a tandem type sputtering apparatus for transferring substrates together with a jig and a cluster tool type sputtering apparatus for transferring only substrates. [0004] In the tandem spraying equipment, many operating chambers such as loading chamber, unlo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/50C23C14/56H01J37/34
CPCC23C14/564C23C14/34H01J37/34H01J37/3447C23C14/568C23C14/50
Inventor 二川正康水户清
Owner SHARP KK
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