Unlock instant, AI-driven research and patent intelligence for your innovation.

Wireless electronic communicating device

A communication device and wireless electronic technology, applied in the direction of static electricity, electrical components, etc., can solve problems such as bad receiving ability and influence of wireless signal receiving ability

Inactive Publication Date: 2005-10-12
BENQ CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This shielding effect will prevent high-frequency noise from penetrating the conductive layer to radiate along the direction perpendicular to the conductive layer, but instead will concentrate high-frequency noise on the edge of the conductive layer and radiate out.
[0005] In this way, the wireless sensitivity of the antennas disposed adjacent to the edge of the conductive layer will be greatly affected.
Since wireless reception capability has a great influence on the quality of electronic communication devices, poor reception capability is undesirable for designers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wireless electronic communicating device
  • Wireless electronic communicating device
  • Wireless electronic communicating device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0043] Please also refer to figure 1 , Figure 2A and image 3 , figure 1 It is an exploded schematic view showing the printed circuit board and the metal film key of the wireless electronic communication device according to the first embodiment of the present invention; Figure 2A It is a top view showing the metal thin film button of the wireless electronic communication device according to the first embodiment of the present invention; and image 3 It is a cross-sectional view showing the wireless electronic communication device 100 along the section line 3A-3A' in FIG. 2 .

[0044] The electronic communication device 100 includes a printed circuit board 102 , an antenna element 106 , an insulating layer 108 and an ESD protection layer 112 . The ESD protection layer 112 can be coated on the surface of the insulating layer 108 by coating. The printed circuit board 102 has a high frequency noise generating area 104 . The high-frequency noise generation area 104 is an are...

no. 2 example

[0056] Please refer to Figure 6 , which represents a top view of the metal thin film key of the electronic communication device according to the second embodiment of the present invention. The difference between the second embodiment and the first embodiment lies in the shape of the electrostatic protection layer 603 and the relative positional relationship between the antenna feeding point (feed-in hole) 1021 and the electrostatic protection layer 603, and the rest are the same as the first embodiment. The same reference numerals are used and will not be described again.

[0057] The electrostatic protection layer 603 has a first edge 6031 and a second edge 6032, wherein the first edge 6031 and the second edge 6032 are separated by at least a predetermined distance L 5 and L 6 The distance of is adjacent to the antenna feed point 1021. That is, the distance between the first edge 6031 and the second edge 6032 and the antenna feeding point 1021 is at least L 5 and L 6 ab...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention consists of a printed circuit board, an antenna component, an insulation layer and an electrostatic protection layer. The antenna component is mounted at the side near the printed circuit used to transmit and receive the wireless signal sent by printed circuit. The insulation layer is located on the printed circuit board, on which an electrostatic protection layer is mounted. The electrostatic protection layer has at least one hollow out area whose location corresponds to the area of printed circuit board generating high frequency noise. The hollow out area radiates out the high frequency noise generated from area of printed circuit board generating high frequency noise to reduce interference of noise to antenna.

Description

technical field [0001] The present invention relates to a wireless electronic communication device, and more particularly to a wireless electronic communication device that reduces noise interference of antenna elements. Background technique [0002] For wireless electronic communication devices, such as handheld mobile phones, most of the external static electricity comes from the fingers of the human body, especially in a dry and cold environment, the human body is more likely to be charged with static electricity. When a user with a charged finger uses a button, the static electricity will be transmitted from the fingertip to the touched button in an instant. Therefore, the interference of electrostatic discharge (ESD) is harmful to the electronic components in the wireless electronic communication device. [0003] In traditional wireless electronic communication devices, in order to prevent external static interference, a grounded conductive layer is provided under the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05F3/02
Inventor 邱增智李宜音
Owner BENQ CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More