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Carrier band forming method and device thereof

A molding method and molding device technology, which are applied in the field of carrier tape molding and its devices, can solve the problems of carrier tape film peeling, carrier tape surface roughness, and electronic components, etc., and achieve improved reliability, smooth sealing surface, and high strength. enhanced effect

Inactive Publication Date: 2005-11-30
曾作良
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is that the surface of the carrier tape formed by the known carrier tape forming structure is relatively rough, and the rough surface of the carrier tape will cause uneven sealing force of the adhesive film, so that the sealed carrier tape adhesive If the film falls off, the subsequent preparation process cannot be completed, and the thickness of the formed carrier tape pocket cannot be consistent, and the packaging protection provided by the electronic components is relatively fragile

Method used

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  • Carrier band forming method and device thereof
  • Carrier band forming method and device thereof
  • Carrier band forming method and device thereof

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Embodiment Construction

[0030] Figure 6 and Figure 7 The carrier tape molding device used in the carrier tape molding method of the present invention is shown. The carrier tape molding device mainly uses an extruder to output the carrier tape 2 to be molded through a die 1 and reaches the carrier tape through a molding die 3. 2 molding. Among them, the forming mold 3 includes a first mold base 31 and a second mold base 32. The first mold base 31 is a base, and its bottom surface is provided with a plurality of equally spaced convex mold portions 33, and the bottom surface of each punch portion 33 is provided with air holes 35 at the opposite corners; the second mold base 32 is a base The bottom surface of the body is provided with a plurality of concave mold portions 34 arranged at equal distances, and the inner bottom surface of each concave mold portion 34 is provided with air holes 35 at opposite two corner ends. Therefore, each convex mold portion 33 in the first mold base 31 of the molding mold 3...

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Abstract

Carry belt forming method and its device, which are characterized in that forming model comprises first die holder with complex convex mold parts equidistance arrayed on bottom, and second die holder with complex concave mold parts equidistance arrayed on bottom; the convex mold parts correspond to concave mold parts and form shaping zone for processing carry belt.

Description

Technical field [0001] The invention relates to a molding method and device for manufacturing a carrier tape for carrying electronic components. Background technique [0002] Carrier tape is a continuous strip container used to hold small electronic components in the electronics industry, such as figure 1 As shown, most of them use PS, PC or other plastic materials to form a continuous strip structure by integral extrusion molding. A plurality of recesses 21 are equally spaced on the carrier tape 2, and the bottom and sides of each recess 21 are equal. Holes 22 are provided, and electronic components can be placed in the recesses 21, and then taped on the carrier tape 2 to cover the recesses 21 to prevent the electronic components from falling out. [0003] When the carrier tape 2 packed with electronic components is sent to the electronics factory for the plug-in preparation process, the mechanical equipment is used to tear off the tape while using the suction cups on the robot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/22
Inventor 曾作良
Owner 曾作良