Method for manufacturing ic card by laminating a plurality of foils
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JT
- Publication Date
- 2005-12-28
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
field of invention
[0001] The invention relates to an IC card manufacturing method. More specifically, the present invention relates to a method of manufacturing an IC card by laminating at least two foil sheets formed with holes corresponding to COB (Chip On Board) and bonding them to each other by pressure. Background technique
[0002] IC cards, which are cards carrying necessary data and programs in COB, are being used in more and more fields because of their convenience and good information retention capabilities. This kind of IC card can generally be divided into: through the contact between the card reader terminal and the electrode, the contact IC card that realizes the input and output of information, has an antenna inside, even if it is not in contact with the card reader terminal, A non-contact IC card capable of inputting and outputting information, and a combined IC card capable of realizing the functions of the above-mentioned contact and non-contact IC cards....