Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product

Abstract

A time-dependent change in potential at a cathode current density of 0.1-20 A / dm<2> is measured to thereby judge the effective embeddability and uniform electrodepositing property of an electrolytic copper plating solution. The measurement is carried out with the rotation speed of a working electrode set at 100-7500 r.m.p., and embeddability is judged from its curved shape. A curve of time-dependent change in potential for a specified time after starting electrolysis is approximated by Boltzman function, and a potential change speed dx and a potential convergent point A2 are determined to judge embeddability.

Description

technical field

[0001] The present invention relates to an analysis method of a copper electroplating solution used for filling copper metal with copper electroplating in via holes and grooves provided in semiconductor products such as printed substrates, semiconductor packaging substrates, or semiconductor substrates, an analysis device thereof, and semiconductor products manufacturing method. In addition, this application is based on Japanese Patent Application No. 082037 in 2003 and No. 350544 in 2003, and the content thereof is included in this application. Background technique

[0002] In copper electroplating baths, additives are usually used. Additives include accelerators and suppressors. By adding them to the plating solution, the plating at the bottom of the via hole is promoted and the plating at the outside of the via hole is suppressed, so that the inside of the via hole can be filled by plating. In order to produce such a phenomenon, it is necessary to ensure...

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