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Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product

An analysis method, copper electroplating technology, applied in the direction of material analysis, analysis materials, measuring devices, etc. by electromagnetic means, can solve the problem of filling deterioration and other problems

Inactive Publication Date: 2006-04-26
TOPPAN PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, in copper electroplating for filling via holes, there is a problem that fillability deteriorates over time from the build-up bath even if the concentration of additives is controlled by CVS measurement.

Method used

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  • Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product
  • Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product
  • Method of analyzing electrolytic copper plating solution, and analyzing device therefor and production method for semi-conductor product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] Hereinafter, the invention described in claims 1-6 will be described in detail through Examples 1-3. device for use Figure 6 device of the structure.

[0090] From the copper plating tank for filling through holes in work, take out 100ml of the plating solution (determined plating solution 5) measured by CVS to control the concentration of additives, put it into a beaker, and place it on the special frame 6. However, since the state of the measured plating solution would change if it was left standing, the plating solution was taken out as a liquid within 2 days.

[0091] In reference electrode 2, a dual structure Ag / AgCl reference electrode (external liquid is 10vol% H 2 SO 4 , the internal liquid is 0.1mol / L KCl 10vol%H 2 SO 4 , Ag / AgCl in the internal liquid), in the working electrode 3, a platinum rotating electrode (with an electrode area of ​​4πmm 2 ), the opposite pole 4 uses a copper column (diameter 8mm).

[0092] The current density of the platinum rot...

Embodiment 2

[0095] The plating bath was taken out from the copper plating tank for filling via holes in operation every two months, and the constant current potential was measured under the same measurement conditions as in Example 1. The above liquids are all measured according to CVS, and the concentration of additives is controlled within a certain concentration.

[0096] exist Figure 13 In , the constant current potential measurement results of a new liquid having the same additive concentration as the above-mentioned liquid and a plating solution every two months are shown. exist Figure 14 in, means Figure 13 dx of constant current potentiometry results shown. From Figure 13 , 14 It can be seen that even if the additive concentration is controlled within a certain concentration by CVS measurement, the fillability will decrease.

Embodiment 3

[0098] Prepare a new liquid and divide it into 2 parts, one part does not put any substance, and the other part puts the area limited to 100cm 2 / L phosphorus-containing copper plate, placed in a static state for 48 hours. Plating was carried out in via holes with a diameter of 100 μm and a depth of 75 μm using two liquids, the former filled via holes and the latter unfilled via holes.

[0099] The two liquids are measured by CVS to determine the concentrations of accelerators and inhibitors, and the concentrations are only different in the degree of error. It can be seen that the fillability of via holes cannot be judged only by controlling the concentration of additives through CVS measurement.

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Abstract

A time-dependent change in potential at a cathode current density of 0.1-20 A / dm<2> is measured to thereby judge the effective embeddability and uniform electrodepositing property of an electrolytic copper plating solution. The measurement is carried out with the rotation speed of a working electrode set at 100-7500 r.m.p., and embeddability is judged from its curved shape. A curve of time-dependent change in potential for a specified time after starting electrolysis is approximated by Boltzman function, and a potential change speed dx and a potential convergent point A2 are determined to judge embeddability.

Description

technical field [0001] The present invention relates to an analysis method of a copper electroplating solution used for filling copper metal with copper electroplating in via holes and grooves provided in semiconductor products such as printed substrates, semiconductor packaging substrates, or semiconductor substrates, an analysis device thereof, and semiconductor products manufacturing method. In addition, this application is based on Japanese Patent Application No. 082037 in 2003 and No. 350544 in 2003, and the content thereof is included in this application. Background technique [0002] In copper electroplating baths, additives are usually used. Additives include accelerators and suppressors. By adding them to the plating solution, the plating at the bottom of the via hole is promoted and the plating at the outside of the via hole is suppressed, so that the inside of the via hole can be filled by plating. In order to produce such a phenomenon, it is necessary to ensure...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/12G01N27/416G01N27/28
Inventor 大久保利一直井克巧水野由香
Owner TOPPAN PRINTING CO LTD
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