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System for airflow management in electronic enclosures

A technology in electronic equipment and racks, which is applied in the fields of electrical equipment structural parts, electrical components, electrical digital data processing, etc.

Active Publication Date: 2006-05-03
INT BUSINESS MASCH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the insulating properties of epoxy glass, this method can only be operated at about 200 watts or at most 300 watts under the most suitable airflow and temperature conditions

Method used

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  • System for airflow management in electronic enclosures
  • System for airflow management in electronic enclosures
  • System for airflow management in electronic enclosures

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Embodiment Construction

[0032] The invention will be described in detail below by way of example with reference to the embodiments shown in the drawings. It should be understood that the following embodiments are presented by way of example only and should not be construed as limiting the inventive concept to any specific physical structure.

[0033] Furthermore, use of the terms "upper," "lower," "front," "rear," "above," "below" and similar terms should not be construed to limit the invention to a particular orientation unless otherwise stated. Rather, these terms should be understood to denote a relative concept only. For purposes of this disclosure, the terms "printed circuit board (PCB)" and "printed wiring board (PWB)" are synonymous terms.

[0034] 1 and 2 show an exemplary embodiment of the invention comprising a so-called central electronic complex 10 (CEC) of a computer system. The CEC 10 consists of a chassis (eg, cage 12), a backplane or midplane 14 as shown, and a circuit board or sub...

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PUM

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Abstract

A system for managing airflow within a rack of electronic equipment, the system comprising: a backplane assembly including at least one backplane connector; at least one daughter card; and a plurality of An assembly on a subcard and capable of being positioned in such a manner as to facilitate airflow from front to rear, wherein incoming cooling air impinges on the backplane assembly and is divided into at least two flow segments flowing in different directions along a surface defining the backplane assembly .

Description

Background of the invention [0001] Computers are typically provided with a computer cage structure, which may include a thin sheet metal frame and accommodate a backplane. A backplane is a circuit board (eg, main card) or frame that supports other circuit boards, devices, and wiring within the device and provides power and data signals to the supported devices. The main plug-in can be a main circuit plug-in in the computer, and the main circuit plug-in can be connected with other logic circuit boards and components. The cage structure of the computer is adapted to accommodate and detachably support at least one, preferably a plurality of optional components or sub-inserts (blades or nodes), which, when operatively installed in the corresponding cage structure, can improve computer performance. For example, we know that it is possible to install a backplane and various circuit boards (such as processor cards, input-output cards and so-called memory riser cards) into an open c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20H05K7/20563
Inventor W·D·贝克尔J·P·科拉多E·E·克鲁兹M·J·费希尔G·F·戈特
Owner INT BUSINESS MASCH CORP
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