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Method of adding mass to MEMS structures

A detection mass body and substrate technology, applied in the field of MEMS devices, can solve the problems of increased weight, unpopularity, and increased size of the detection mass body

Inactive Publication Date: 2012-04-25
FREESCALE SEMICON INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Consequently, it is difficult to substantially increase the weight of the proof mass without substantially increasing the size of the sensor, a result that is highly unfavorable in view of the current demands in the art for further miniaturization of these devices. of

Method used

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  • Method of adding mass to MEMS structures
  • Method of adding mass to MEMS structures
  • Method of adding mass to MEMS structures

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0045] This example is used to illustrate the effect of CTE differential stress between the appendage of the proof mass and the base for a proof mass separated from the base by a narrow rod and the appendages are composed of different materials (i.e. aluminum and polysilicon). transfer.

[0046] Repeat the simulation test of comparative example 1, but adopt such as Image 6 Proof masses of the type indicated. The detection mass body 51 is composed of a polysilicon substrate 53 and a square appendage 55 connected thereto. The appendages consist of a layer of polysilicon 59 with a layer 57 of aluminum deposited to a thickness of 3 microns. The side length of the appendages is 100 μm. The appendages are separated from the base body by rods 61 having a width of 3 microns and a length of 2 microns, the main surfaces of the appendages being parallel to those of the base body.

[0047] exist Figure 5 The graph in the figure shows the calculated stresses during the temperature c...

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PUM

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Abstract

A proof mass (11) for a MEMS device is provided herein. The proof mass comprises a base (13) comprising a semiconductor material, and at least one appendage (15) adjoined to said base by way of a stem (21). The appendage (15) comprises a metal (17) or other such material that may be disposed on a semiconductor material (19). The metal increases the total mass of the proof mass (11) as compared toa proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage (15) by way of a stem (21) prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.

Description

technical field [0001] The present invention relates generally to MEMS devices and, in particular, to proof masses for MEMS devices. Background technique [0002] Advances in micromachining and other microfabrication techniques and processes have enabled the fabrication of a wide variety of MicroElectroMechanical Sensors (MEMS) and other such devices. These devices include moving rotors, gears (transmissions), switches, accelerometers, miniaturized sensors, actuator systems, and other such structures. [0003] One promising application of MEMS technology is in the field of inertial sensors. Inertial sensors work by sensing the displacement of a proof mass mounted on a compliant suspension. The proof-mass displacement ΔX is related to the mass (m) of the proof-mass, the acceleration (a), and the spring constant (k) of the compliant suspension, as shown in Equation 1: [0004] ΔX=ma / k (equation 1) [0005] The sensitivity of an inertial sensor is limited by the ability of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00C23F1/00G01P3/00B32B15/04G01P9/04G01P15/08H01L
CPCB81B3/0078G01P2015/0814G01P15/0802B81B2201/025G01P15/08G01P15/0888Y10T428/24917B32B9/00B81B7/02C23F1/00G01P3/00
Inventor 安德鲁·C.·麦克尼尔加里·李加里·J.·奥'·布里恩
Owner FREESCALE SEMICON INC
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