Image processing method, substrate inspection method, substrate inspection apparatus and method of generating substrate inspection data
A technology of image processing and data, applied in the field of image processing, can solve the problem of not being able to fully ensure the accuracy of the observation object extraction
Active Publication Date: 2006-07-05
ORMON CORP
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For this purpose, the color of the object to be observed is defined in a specific range, and only the method of extracting the color included in this range cannot sufficiently ensure the extraction accuracy of the object to be observed
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[0067] figure 1 It is a block diagram of a substrate inspection device according to an embodiment of the present invention.
[0068] This substrate inspection apparatus has a function of processing an image obtained by photographing a substrate 1 to be inspected, and judging whether or not a site to be inspected on the substrate 1 is appropriate. The portion to be inspected can be appropriately set according to the type of substrate to be inspected. For example, in the case of inspecting a substrate printed with cream solder, the printed part of cream solder can be used as the inspection object, and in the case of inspecting the substrate after component mounting, the part body can be inspected. In the case of inspecting a board after soldering, fillets of each component may be inspected.
[0069] The substrate inspection apparatus described above is composed of an imaging unit 3 , a light projecting unit 4 , a control processing unit 5 , an X-axis table unit 6 , a Y-axis ta...
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The invention provides a method of image processing, a method of substrate inspection and a method of making inspection data for inspecting the substrate, which can enhance the precision of image processing by making the observation object extract with good precision, even if the tone of the observation object is varied to some extent. In the reference image obtained by imaging the bare substrate before paste solder printing, an image of a reddish pad appears. In good images obtained by imaging a substrate coating with paste solder, the image of paste solder appears in a bluish state. In an automatic teaching process, for each of the reference image and each pixel of good images, each hue data of R, G, and B is computed. The variance in each hue data is computed for each corresponding group of pixels. If the variance in the blue color component exceeds the pixel with the threshold, the pixel is extracted, and the image region constituted with extracted pixel is considered as a melt welding printing region, the region is inspected and the model is set.
Description
technical field [0001] The present invention relates to a technique for applying predetermined image processing to an object to be observed in the image by processing a color image composed of a combination of two or more color data. [0002] In addition, the present invention relates to a technique for processing a color image of a substrate to automatically inspect a site to be inspected in the image, and a technique for creating inspection data necessary for the automatic inspection. Background technique [0003] The general production process of component-mounted substrates includes the process of printing cream solder on the printed wiring board, the process of mounting components on the printed position of the solder cream, and the process of heating the substrate after mounting the components. A process in which parts are soldered to a substrate. [0004] In the case of fabricating a component-mounted substrate in the above-described flow, it is desirable to check in...
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IPC IPC(8): G06K9/36G01N21/88
Inventor 村上清石羽正人四谷辉久
Owner ORMON CORP