Lead-free solder and its preparation method

A technology of lead-free solder and solder, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of many bridging defects, difficult discharge, excessive welding slag, etc., and achieve bright solder joint surface, avoid Lead poisoning, the effect of improving welding quality

Inactive Publication Date: 2006-07-12
THOUSAND ISLAND METAL FOIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering properties, lead is a toxic substance. Many technical data, the use of lead-free solder is generally based on the Sn-Ag-Cu system
However, when the existing lead-free solder is soldered at high temperature, there are often too much welding slag and many bridging defects

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The present invention will be described in further detail below in conjunction with specific implementation, but the content of the present invention is not limited to the examples.

[0023] Element

1

2

3

4

5

6

Cu(%)

0.1

0.1

2

2

1.0

1.2

Ni (%)

0.001

0.001

0.5

0.5

0.1

0.3

Ce(%)

0.001

0.0001

0.1

0.1

0.08

0.068

P

0.0001

0.1

0.063

Ga

0.0001

0.1

0.072

sn

99.8979

99.8988

97.3

97.3

98.757

98.36

[0024] Preparation

[0025] Since Cu, Ni, and Ce are elements with high melting points, in order to balance the melting point in tin-based smelting, an intermediate alloy process must be adopted.

[0026] Master alloy ratio

[0027] SnCu: Sn90% Cu10%;

[0028] SnNi: Sn98% Ni2%;

[0029] SnCe: Sn97....

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PUM

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Abstract

The invention relates to a welding material, especially providing a leadless solder with better anti-oxidation ability in high temperature and relative preparation method. Said solder comprises following weight percents: 0.1-2% Cu, 0.001-0.5% Ni, 0.0001-0.1% Ce, 0.0001-0.1% P or GaO and Sn; or else 0.0001-0.1% Ce, 0.1-2% Cu, 0.001-0.5% Ni, 0.0001-0.1% P and Sn; or else 0.001-0.5% Ni, 0.1-2% Cu, 0.0001-0.1% Ce, 0.0001-0.1% Ga and Sn. The inventive leadless solder comprises following advantages: environment-friendly, effective prevention of lead poisoning, less oxidation sludge in high-temperature welding and anti-oxidation ability.

Description

technical field [0001] The invention relates to soldering materials, in particular to a lead-free solder with good oxygen resistance under high-temperature soldering conditions and a preparation method thereof. Background technique [0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering properties, lead is a toxic substance. In many technical data, the use of lead-free solder is generally based on the Sn-Ag-Cu system. However, when the existing lead-free solders are soldered at high temperature, there are often too much welding slag and many bridging defects. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide an environmentally friendly high-temperature anti-oxidation solder, which does not contain lead, has less oxidation slag in the tin furnace, and is a lead-free sold...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C1/03
Inventor 黄守友
Owner THOUSAND ISLAND METAL FOIL
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