Lead-free solder and its preparation method

Abstract

The invention relates to a welding material, especially providing a leadless solder with better anti-oxidation ability in high temperature and relative preparation method. Said solder comprises following weight percents: 0.1-2% Cu, 0.001-0.5% Ni, 0.0001-0.1% Ce, 0.0001-0.1% P or GaO and Sn; or else 0.0001-0.1% Ce, 0.1-2% Cu, 0.001-0.5% Ni, 0.0001-0.1% P and Sn; or else 0.001-0.5% Ni, 0.1-2% Cu, 0.0001-0.1% Ce, 0.0001-0.1% Ga and Sn. The inventive leadless solder comprises following advantages: environment-friendly, effective prevention of lead poisoning, less oxidation sludge in high-temperature welding and anti-oxidation ability.

Description

technical field

[0001] The invention relates to soldering materials, in particular to a lead-free solder with good oxygen resistance under high-temperature soldering conditions and a preparation method thereof. Background technique

[0002] The soldering materials in the electronics industry are mainly tin-lead alloys. Although tin-lead alloys have excellent soldering properties, lead is a toxic substance. In many technical data, the use of lead-free solder is generally based on the Sn-Ag-Cu system. However, when the existing lead-free solders are soldered at high temperature, there are often too much welding slag and many bridging defects. Contents of the invention

[0003] The technical problem to be solved by the present invention is to overcome the deficiencies of the above-mentioned prior art, and provide an environmentally friendly high-temperature anti-oxidation solder, which does not contain lead, has less oxidation slag in the tin furnace, and is a lead-free sold...