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Wire loop, semiconductor device having same and wire bonding method

一种引线接合、半导体的技术，应用在引线回路，能够解决第一接合点损坏等问题，达到低轮廓的效果

Active Publication Date: 2006-08-09
KAIJOO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] However, in the technique disclosed in U.S. Patent Application Publication No. 2004 / 0104477, the crushed portion is formed by the capillary at the first bonding point on the top of the lead wire as well as the bonding ball, so there is a possibility that the first bonding point will be damaged
Additionally, a lead that has been crushed at the first joint can cause localized protrusion in the direction opposite the second joint

Method used

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  • Wire loop, semiconductor device having same and wire bonding method
  • Wire loop, semiconductor device having same and wire bonding method
  • Wire loop, semiconductor device having same and wire bonding method

Examples

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Embodiment Construction

[0049] Now, a wire loop, a semiconductor device, and a wire bonding method according to the present invention will be described hereinafter with reference to the accompanying drawings, in which like components are denoted by like reference numerals or numerals in each of the several drawings.

[0050] first reference Figure 1A and 1B , shows a lead loop according to the present invention and a semiconductor device 10 incorporating the lead loop therein. In the semiconductor device 10, a semiconductor chip 2 is attached to a lead frame 1 and has a pad 2a, which is a first bonding point A, thereon. The lead loop of the lead 3 is formed to have a substantially triangular shape as a whole, and includes a neck H having a ball 30 bonded to the pad 2a or the first joint A, and a main body or a generally inclined portion S, the main body The portion or substantially inclined portion S has an end portion bonded to the lead 1 a of the lead frame 1 or the second bonding point Z. Neck ...

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PUM

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Abstract

A wire loop comprises a wire connecting a first bonding point and a second bonding point therethrough, wherein the wire includes a ball bonded to the first bonding point, a neck portion adjacent to the ball and a major portion extending from the neck portion to the second bonding point. The neck portion includes a riser part which extends, from the bonded ball, obliquely upward in a direction toward the second bonding point, and the riser part is formed by a top portion of the ball which has entered an opening of a capillary and been shaped at the time of ball bonding. The riser part is formed by inclining the top portion of the ball, which enters the opening of the capillary at the time of ball bonding, which inclining is done by moving the capillary obliquely upward toward the second bonding point.

Description

technical field [0001] The present invention relates to a wire bonding method for connecting a first bonding point and a second bonding point with a wire, a wire loop having a specific shape, and a semiconductor device having such a wire loop incorporated therein. Background technique [0002] Conventionally, as shown in FIG. 9A or 9B, in the process of manufacturing a semiconductor device, a lead wire for connecting the pad 2a of the semiconductor chip 2 attached to the lead frame 1 or the first bonding point A to the lead frame 1 has been performed. 1a or the second bonding point Z is connected by wire 3 through wire bonding. Typically, the loop shape of the lead wire 3 connecting the first and second bonding points A and Z includes trapezoidal and triangular shapes as shown in FIGS. 277558, respectively. [0003] A lead wire loop having a trapezoidal shape shown in FIG. 9A is formed through a series of steps shown in FIG. 10 . First, in step (a) of FIG. 10, the capilla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/60
CPCH01L2224/05599H01L2924/01006H01L2224/48227H01L2924/01004H01L2924/00014H01L2924/01002H01L2924/01082H01L2224/85181H01L24/78H01L2224/48091H01L2924/01057H01L2924/01015H01L2924/01033H01L2924/01005H01L2224/78301B23K20/004H01L2224/45099H01L2224/85148B23K2201/32H01L2224/48095H01L24/48H01L2224/8518H01L2224/48465H01L24/85H01L2224/85399B23K2101/32H01L2224/85205H01L2924/181H01L2924/00H01L23/488
Inventor 藤泽洋生石桥昌今井玲
Owner KAIJOO KK