Micro contact-element and making method

A manufacturing method and micro-contact technology, which can be used in contact manufacturing, contact components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as bending of silicon substrates, increased failure rate, and poor process qualification rate.
CN1815825AInactive Publication Date: 2006-08-09MPI CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
MPI CORP
Publication Date
2006-08-09
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The method includes steps: forming a conductive film on a surface of not electroconductive base plate; forming masking layer with a patternized opening on the conductive film; depositing a conductive material into the opening on the masking layer; removing masking layer; removing the conductive film to make micro contact element made from conducting material separate from base plate.
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Description

technical field

[0001] The present invention is related to a contact element, and more specifically refers to a micro-contact element and a manufacturing method thereof. Background technique

[0002] When testing high-density or high-speed electrical devices (such as LSI or VLSI circuits), it is necessary to use a probe card (Probe Card) with a large number of micro-contact elements (probes), so that the micro-contact elements can be used as a flexible And can provide electrical connection conductor characteristics, as an element that is electrically connected to the object under test, such as a test contact element for LSI and VLSI chips, semiconductor wafers, chip burn-in, packaged semiconductor devices, and printed circuit boards for. Of course, the micro-contact element can also be used as the IC lead of the IC package. For the convenience of subsequent description, the micro-contact elements are mainly described as the probes of the probe card.

[0003] Commonly used...

Claims

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