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Method for binding IC chip and flexible circuitboard on panel display

A technology of flexible circuit boards and flat panel displays, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problems of large number of machines, disconnected module function display, manual contact and secondary pollution, etc., to achieve simplification Technological process, solving functional defects, and avoiding bad effects of related functions

Active Publication Date: 2010-05-12
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of the above process is that the process is long and requires a large number of machines. The two types of ACF, COG and FOG, need to be attached twice separately (there is an ACF edge between the two types of ACF) and two times of main pressure curing. There are more human hand contact and secondary pollution, and it will lead to the disconnection of the metal pins at the edge of the ACF on the glass of some modules, resulting in various defects such as poor display of module functions

Method used

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  • Method for binding IC chip and flexible circuitboard on panel display
  • Method for binding IC chip and flexible circuitboard on panel display
  • Method for binding IC chip and flexible circuitboard on panel display

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Embodiment Construction

[0027] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] 1. Process flow embodiment of COG-FOG dual-purpose ACF of the present invention

[0029] refer to figure 1 and figure 2 , the flat panel display that is ready to go on the machine is made up of a glass front cover (61), a glass back cover (62) and a liquid crystal cell (7) in the middle, and there are Integrated circuit chip (IC) binding pin position 11 and flexible printed circuit board (FPC) binding pin position 12; Attached under the conditions of certain pressure, certain temperature and certain time such as image 3 and Figure 4 COG-FOG dual-purpose ACF 3 shown, ACF 3 covers the area of ​​bonding pin bit 11 of integrated circuit chip (IC) 4 and FPC bonding pin bit 12; then bond IC 4, IC 4 pair After the bit is correct, bind IC 4 on the COG-FOG dual-purpose ACF 3, such as Figure 5 and Figure 6 A...

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Abstract

This invention discloses a method for binding an IC chip and a soft CB on a panel display including: adhering an anisotropy conduction film on a metal lead region of a panel display and the conductionfilm can cover the binding pin positions of the CB, then aligning the IC chip then binding it on the film, then binding the CB on the pin positions just opposite to the conduction film, then pressingthe IC chip and the soft CB to solidify the conduction film to conduct the chip and the soft CB with the panel display and the film between the chip and the CB is in the state of the anisotropy conduction film edge.

Description

technology field; [0001] The present invention relates to the anisotropic conductive film (ACF) in the manufacturing process of the display module, in particular to a method of using the dual-purpose anisotropic conductive film to bind the integrated circuit chip to the glass and the flexible circuit board to the glass at one time. Craft process on glass. Background technique [0002] Early liquid crystal display LCDs were basically letters and fixed images, but now and in the future, LCD displays in mobile products require programmable VGA images, which can be used in different sizes. Meet different usage requirements. There are very strong calls for further thinning and reducing the mass of LCDs. At present, a technology that can meet this requirement is COG (chip on glass, the process of binding integrated circuit chips to glass). In an LCD display using COG technology, integrated circuit chip (IC) devices are mounted directly on the same glass substrate that is part o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04H05K3/00
Inventor 朱景河
Owner TRULY SEMICON