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Dissipating apparatus for integrated circuit chip and display module including the same

A heat dissipation device and display module technology, applied in the direction of valve operation/release device, circuit, valve device, etc., can solve the problems of plasma display module noise, increase production cost, etc.

Inactive Publication Date: 2006-11-01
SAMSUNG SDI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Yet such processing must also have the installation program of cooling element except cooling fan will be installed on the chassis 40
Therefore, the production cost is increased, and at the same time, noise and vibration are generated in the plasma display module due to the operation of the cooling fan.

Method used

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  • Dissipating apparatus for integrated circuit chip and display module including the same
  • Dissipating apparatus for integrated circuit chip and display module including the same
  • Dissipating apparatus for integrated circuit chip and display module including the same

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Embodiment Construction

[0034] Embodiments of the present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.

[0035] image 3 is an exploded perspective view of a heat sink 160 for an IC chip according to an embodiment of the present invention, and Figure 4 yes image 3 Sectional view taken along line IV-IV. In one embodiment, the heat sink 160 is capable of efficiently dissipating heat generated by the IC chip 155 driving the image-generating panel, and includes a chip contact plate 161 and a heat sink plate 165 .

[0036] The chip contact plate 161 is attached in contact with the IC chip 155 and receives heat emitted from the IC chip 155 using thermal conduction. In one embodiment, chip contact plate 161 is attached to IC chip 155 by thermally conductive double-sided tape (not shown).

[0037] In one embodiment, the heat dissipation plate 165 has a plurality of connection portions 166 and heat dissip...

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Abstract

A heat dissipating apparatus for an IC chip, having a structure capable of effectively dissipating heat created by an IC chip to the outside, and a display module including the same are disclosed. In one embodiment, the display module includes a panel that forms an image, a chassis disposed at the rear of the panel to support the panel, at least one IC chip that emits heat mounted on at least one circuit board installed at the rear of the chassis, and a heat dissipating apparatus that dissipates heat emitted by the IC chip to the outside. The heat dissipating apparatus is attached to contact the IC chip, and has a heat conducting chip contact plate, and a heat conducting heat discharging plate formed in one piece with a plurality of mutually proximal joining portions joined to the chip contact plate, and a plurality of heat dissipating portions bent to protrude outward from the joining portions to connect the joining portions.

Description

[0001] Cross References to Related Patent Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2005-0024566 filed with the Korean Intellectual Property Office on March 24, 2005, the disclosure of which is incorporated herein by reference. technical field [0003] The invention relates to a heat dissipation device for an integrated circuit (IC) chip and a display module including the same. More particularly, the present invention relates to a heat sink having a structure capable of efficiently dissipating heat generated by an IC chip to the outside, and a display module including the same. Background technique [0004] The plasma display module is a flat panel display that uses discharge gas to display images. This technology has been gaining traction recently due to its ability to produce displays with a slim profile, large size, wide viewing angle, and high resolution. [0005] Such a plasma display module has two flat panels place...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/36H05K7/20
CPCH01L23/3672H01L23/467H05K7/20963H01L2924/0002H01L2924/00F16K11/074F16K27/04F16K31/605
Inventor 郑光珍
Owner SAMSUNG SDI CO LTD
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